how to build hardware lean

How to Build Hardware Lean By Joo Aun Saw and Zoran Angelovski YOW! Connected

Who we are?

Our background (combined): §  Telecoms, Smart Energy, IoT. §  DiUS. §  Products. §  Current.

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Our talk

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$

Starter Kits / SBC Production Module

Evaluation Module

NRE

Per Unit Cost

Chip Level

1 - 3 3 - 10 10 – 500(?) Prod

Building hardware

§  What you needed – yesterday. §  How it was done – yesterday. §  How it is done – today.

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What you needed - yesterday

Capabilities: §  Specialist skills and tools.

What was ‘hardware’: §  Discrete → some level of integration. §  Complex PCB. §  Equipment was expensive.

Barriers were higher but still doable.

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How it was done - yesterday

§  Assembling a prototype. §  Bread board. §  Your own PCB. §  Buy parts. §  Time consuming. Barriers were higher but still doable.

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How it is done - today §  SoC’s, Eval Modules, Starter Kits

(+Breakout boards) and Prod Modules.

§  Lower Cost and availability. §  Tools and building.

Cypress PSoC® is the world's first programmable embedded system-on-chip integrating configurable analog and digital peripheral functions

Arduino Uno Starter Kit

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Breakout Board

From concept to proof-of-value

§  What is available today? §  Which approach and why? §  Exploring opportunities.

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What is available today?

Open source kit, SBC → Custom design: §  Arduino, Rasp Pi with breakout boards. §  Evaluation modules (most chip vendors). §  Schematic and layout (Eagle, KiCAD). §  Parts (Digi-Key, Mouser, Element14). §  PCB (OshPark). §  Mechanical - print your own.

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Leverage specialists

Engage partners directly and indirectly: §  Industrial design. §  RF / analogue circuit. §  Dangerous voltages (240V).

…leverage your partners’ expertise.

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Which approach and why?

ESI / IoT gateway: §  Proof-of-Value. §  Direct to PCB. §  Mechanical. PowerVu: §  Why did we choose a partner? §  Specialist hardware, industrial design.

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Exploring opportunities

Project: Multispectral Imaging for Agriculture Status: Proof-of-Concept §  Minimised commitment. §  Proof-of-Value. §  Business case.

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Experimenting with hardware

Over to Joo… §  Different levels of experimentation. §  Before you start. §  Case study. §  Issues to consider.

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Different levels of hardware experimentation

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Before you start

Consider: §  Why, what, where? §  How many? §  Tools? §  Skills? §  Software stack and licensing?

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$ NRE

Per Unit Cost

Multispectral imager

Low cost high resolution multispectral imager. Challenges:

§  First airborne device, inexperience. §  Unproven hardware and software. §  Size and weight constraints. §  Difficult to test (highly dependent on weather).

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Multispectral imager (the lean way)

§  Defer custom PCB. §  Don’t reinvent the wheel. §  Iterate. §  Test cycles. §  UX (User Experience).

1st prototype:

3rd prototype:

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Issues to consider

Experimentation Production Work Environment – smells and fumes, noise, common sense – 240V. ü ü

Certification - ZigBee, USB, Wi-Fi. ? ü ü Safety and Regulatory - EMC, RCM (regulatory compliance mark), CASA certificate.

? ü

Parts - EoL, hard to get, changes in spec. ü ü

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Lastly…

§  Some words about manufacturing. §  What’s the opportunity for business?

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Experimenting à Manufacturing

Here you have to do more that just the fun stuff… …get the factory and partners involved early

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Process Regulatory approvals

Leadtimes

Procurement Records

Revision control Components

Changes

Alternative Parts Warranty

What’s the opportunity for business?

§  Explore Opportunities. §  Our brand. §  Consultancy service. §  Dedicated development team. §  Product range.

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DiUS product range

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Smart Energy ChargeIQ

Smart Energy ESI (Software)

Sensor / IoT

Local Smoke Alert

Presentation

Cloud Based Data Service

LiveVu

Get in touch e. zangelovski@dius.com.au e. jasaw@dius.com.au @dius_au Linkedin.com/company/dius-computing

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