how to build hardware lean
TRANSCRIPT
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How to Build Hardware Lean By Joo Aun Saw and Zoran Angelovski YOW! Connected
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Who we are?
Our background (combined): § Telecoms, Smart Energy, IoT. § DiUS. § Products. § Current.
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Our talk
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$
Starter Kits / SBC Production Module
Evaluation Module
NRE
Per Unit Cost
Chip Level
1 - 3 3 - 10 10 – 500(?) Prod
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Building hardware
§ What you needed – yesterday. § How it was done – yesterday. § How it is done – today.
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What you needed - yesterday
Capabilities: § Specialist skills and tools.
What was ‘hardware’: § Discrete → some level of integration. § Complex PCB. § Equipment was expensive.
Barriers were higher but still doable.
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How it was done - yesterday
§ Assembling a prototype. § Bread board. § Your own PCB. § Buy parts. § Time consuming. Barriers were higher but still doable.
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How it is done - today § SoC’s, Eval Modules, Starter Kits
(+Breakout boards) and Prod Modules.
§ Lower Cost and availability. § Tools and building.
Cypress PSoC® is the world's first programmable embedded system-on-chip integrating configurable analog and digital peripheral functions
Arduino Uno Starter Kit
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Breakout Board
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From concept to proof-of-value
§ What is available today? § Which approach and why? § Exploring opportunities.
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What is available today?
Open source kit, SBC → Custom design: § Arduino, Rasp Pi with breakout boards. § Evaluation modules (most chip vendors). § Schematic and layout (Eagle, KiCAD). § Parts (Digi-Key, Mouser, Element14). § PCB (OshPark). § Mechanical - print your own.
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Leverage specialists
Engage partners directly and indirectly: § Industrial design. § RF / analogue circuit. § Dangerous voltages (240V).
…leverage your partners’ expertise.
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Which approach and why?
ESI / IoT gateway: § Proof-of-Value. § Direct to PCB. § Mechanical. PowerVu: § Why did we choose a partner? § Specialist hardware, industrial design.
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Exploring opportunities
Project: Multispectral Imaging for Agriculture Status: Proof-of-Concept § Minimised commitment. § Proof-of-Value. § Business case.
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Experimenting with hardware
Over to Joo… § Different levels of experimentation. § Before you start. § Case study. § Issues to consider.
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Different levels of hardware experimentation
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Before you start
Consider: § Why, what, where? § How many? § Tools? § Skills? § Software stack and licensing?
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$ NRE
Per Unit Cost
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Multispectral imager
Low cost high resolution multispectral imager. Challenges:
§ First airborne device, inexperience. § Unproven hardware and software. § Size and weight constraints. § Difficult to test (highly dependent on weather).
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Multispectral imager (the lean way)
§ Defer custom PCB. § Don’t reinvent the wheel. § Iterate. § Test cycles. § UX (User Experience).
1st prototype:
3rd prototype:
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Issues to consider
Experimentation Production Work Environment – smells and fumes, noise, common sense – 240V. ü ü
Certification - ZigBee, USB, Wi-Fi. ? ü ü Safety and Regulatory - EMC, RCM (regulatory compliance mark), CASA certificate.
? ü
Parts - EoL, hard to get, changes in spec. ü ü
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Lastly…
§ Some words about manufacturing. § What’s the opportunity for business?
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Experimenting à Manufacturing
Here you have to do more that just the fun stuff… …get the factory and partners involved early
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Process Regulatory approvals
Leadtimes
Procurement Records
Revision control Components
Changes
Alternative Parts Warranty
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What’s the opportunity for business?
§ Explore Opportunities. § Our brand. § Consultancy service. § Dedicated development team. § Product range.
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DiUS product range
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Smart Energy ChargeIQ
Smart Energy ESI (Software)
Sensor / IoT
Local Smoke Alert
Presentation
Cloud Based Data Service
LiveVu
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Get in touch e. [email protected] e. [email protected] @dius_au Linkedin.com/company/dius-computing
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