sub-60mv/decade switching in junction-less transistors
TRANSCRIPT
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N. Dehdashti, C.-W. Lee, A.Kranti, R. Yan,
I. Ferain, R. Yu, P. Razavi, JP Colinge
Tyndall National Institute
University College Cork, Ireland
Sub-60mV/dec Subthreshold Slope in Junctionless
Nanowire Transistors
Sub-60mV/dec Subthreshold Slope in Junctionless
Nanowire Transistors
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• Junctionless transistor
•Conduction mechanisms
•Drain electric field
• Subthreshold slope measurements
• Simulations
•Conclusions
OUTLINE
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GateDrain
Source
GateDrain
Source
Source Drain
DrainSourceN+ PolySi Gate
P+ PolySi Gate
B
C
A
N+ Silicon
P+ Silicon
GateDrain
Source
GateDrain
Source
Source Drain
DrainSourceN+ PolySi Gate
P+ PolySi Gate
B
C
A
N+ Silicon
P+ Silicon
A: 3D view of a junctionless transistor
B: cross section of an N-channel device
C: cross section of a P-channel device
Anantomy of Junctionless Transistor
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BOX
TEM Cross section
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• Junctionless transistor
•Conduction mechanisms
•Drain electric field
• Subthreshold slope measurements
• Simulations
•Conclusions
OUTLINE
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GateSource
Drain
The cross section must be small enough for channel region to be depleted on carriers: Electrostatic Pinchoff
Electrostatic Pinchoff
Wsi
tsi
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Increasing Gate Voltage
Below VTHSlightly above VTH
Higher VG Depletion gone
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• Junctionless transistor
•Conduction mechanisms
•Drain electric field
• Subthreshold slope measurements
• Simulations
•Conclusions
OUTLINE
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VD=50mVVD=200mV
VD=400mVVD=600mV
Increasing Drain Voltage
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The high-field
region is
in the drain,
not in the
channel
region
Drain electric field
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• Junctionless transistor
•Conduction mechanisms
•Drain electric field
• Subthreshold slope measurements
• Simulations
•Conclusions
OUTLINE
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-3.0 -2.5 -2.0 -1.5 -1.010
-14
10-13
10-12
10-11
10-10
10-9
10-8
10-7
10-6
Gate Voltage (V)
Drain Current (A)
Vth=-1.5V
JL; W=50nm
Vsd=1.50V
Vsd=1.75V
Vsd=2.00V
Vsd=2.25V
Vsd=2.50V
Vsd=2.75V
Vsd=3.00V
-0.2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
10-12
10-11
10-10
10-9
10-8
10-7
10-6
10-5
10-4
Vbg=0
Gate Voltage (V)
Drain Current (A)
Waf 3;C1; 83
IM; W=50nm
Vsd=3.00V
Vsd=3.25V
Vsd=3.50V
Vsd=3.75V
Vsd=4.00V
Vsd=4.25V
Vsd=4.50V
Vsd=4.75V
Vsd=5.00V
Subthreshold slope
”Regular” inversion-
mode trigate FETJunctionless trigate FET
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0.0 0.4 0.8 1.2 1.610
-14
10-12
10-10
10-8
10-6
Gate Voltage (V)
Drain Current (A
)
VDS=3.0V~5.0V
Step=0.5V
”Regular” inversion-mode trigate FET
VD=4V
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-3.0 -2.5 -2.0 -1.5 -1.010
-14
10-12
10-10
10-8
10-6
Gate Voltage (V)
Drain Curren
t (A
)
VDS=1.5V~2.25V
Step=0.25V
Junctionless trigate FET
VD=1.75V
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• Junctionless transistor
•Conduction mechanisms
•Drain electric field
• Subthreshold slope measurements
• Simulations
•Conclusions
OUTLINE
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Device simulation (ATLAS)
BOX
Gate
Source
DrainLgate
Wsi
tsiA-A’
BOX
Gate
Source
DrainLgate
Wsi
tsiA-A’
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0.0 0.1 0.2 0.3 0.4 0.5 0.6
0.0
5.0x105
1.0x106
1.5x106
2.0x106
Cutline from source to drain (µµµµm)
Electric field (V/cm)
Junctionless
Inversion-mode
Electric field
W=20nm Tsi=5nm, Tox=10nm, L=200nm
Source Drain
Electric field
VDS=2.2V, VGS=VTH-200mV
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Junctionless
Nd=1e19:
Impact ionization is
in the drain
Inversion-mode
Na=2e18:
Impact ionization
is in the channel
region
Impact gen rate_ VDS=2.2V, VGS=0V,
20x5nm_L200
Impact Ionization Rate
Drain
Gate
Drain
Gate
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0.0 0.1 0.2 0.3 0.4 0.5 0.6
8.0
6.0
4.0
0.0
x103
2.0
Drain
Distance along x-direction (µµµµm)
Electron Temperature (K)
Junctionless
Inversion-mode
Source
Electron Temperature
VDS=2.2V, VGS=VTH-200mV
dxxTMe
)()1( ∫=− α
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0.0 0.1 0.2 0.3 0.4 0.5 0.6
x1026
0.0
0.5
1.0
1.5
Source Drain
Distance along x-direction (µµµµm)
Junctionless
Inversion-mode
Impact Ioniczaton G
erneration Rate (s-1cm
-3)
2.0
VDS=2.2V, VGS=VTH-200mV
dxxTMe
)()1( ∫=− α
Impact Ionization Rate
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• Peak electric field is in the drain itself
• Wider high-field region accelerates
electrons to higher impact ionization
rates
• Bandgap narrowing in highly doped silicon
70 to 150 meV for ND=1e19-5e19 cm-3
• Sub-60mV slope observed at VDS=1.75V
instead of 4V in regular device
Conclusions