2001. 02. 28

. IC

. EDS?

. EDS

. IC

I. IC

1. IC

2. IC Mode

IC Intergrated Circuit () .

IC IC Silicon() (Insulator) (Conductor) , 1/2 (,Semiconductor) .

1.

SSI(Small Scale Intergrated, ) : 100

HSI(High S.I ) : 100, ~ 1,000

LSI(Large S.I ) : 1,000 ~ 10,000

VLSI(Very Large S.I ) : 10,000

) 1M DRAM : 56(7.5mm7.5mm) IC Chip 26 .

TV IC LSI,VLSI .

/Chip

1. IC

2.

Semicon-

ductor IC

MOS IC

Bipolar IC

Bi MOS IC

Memory

Logic

RAM

SAM

ROM(Read Only Memory)

RMM(Read Mostly Memory)

RAM(Read Write Memory)

(Data IC : TV Micom)

(EPROM,EEPROM:TV Memory IC)

(SRAM,DRAM:PC,Digital TV )

CCD,Shift register,Bubble Memory

Linear

Digital

TV,VCR,PC,MONITOR,AUDIO IC

Regulator, Amp,...

MOS IC + Bipolar IC

Metal oxide

Semicoductor

Hybrid IC

Thick Film()

Thin Film()

IC(STR),R-Array,C-Array .)

Discrete

Tr,Diode,

1. IC

3. IC Package

Inserting

()

Standard

Package

Shrink

Package

DIP(Dual inline plastic)

DIC(Dual inline ceramic)

TO(Transistor outline)

SIP(Single inline plastic)

SDIP(Shrink DIP)

ZIP(Zig Zag inline plastic)

PGA(Pin grid array ceramic)

SSIP(Shrink SIP)

S M D

()

Surface mouting

Device

S O P

(Small outline

package)

SOP(Small outline L-leaded package of EIAJ)

SOL(Small outline L-leaded package of JEDEC)

SOI(Small outline I-leaded package)

SOJ(Small outline J-leaded package)

SON(Small outline N-leaded package)

QFP(Quard flat L-leaded package(mm)

QFL(Quard flat L-leaded package(inch)

QFI(Quard flat I-leaded package: 0.05mil(1.27mm)

QFJ(Quard flat J-leaded package: 0.05mil(1.27mm)

QFN(Quard flat N-leaded package: 0.05mil(1.27mm)

Q F P

TR

package

Inserting

()

S M D

()

High

Frenquency

New S,M

Full package :TO92,TP92NL,TO92L,TO220,TO220F

TO3,TOP3F,TOP3L

Mini

S Mini

Mini power

U pack

I

Ceramic

Cross pack

* 1 mil = 1/1000 inch

Memory IC( IC)

Regulator

IC

IC

2.54mm

IC

1.27mm

Zig,Zag

IC

1.27mm

IC

1.27mm

IC L IC

1. IC

4. IC

1) IC

2)

Class: Lead Frame , Package .

EPOXY : PLASTIC PAG PHENOL EPOXY .

(Cu) : PLASTIC PAG Lead Frame Cu(Cu-Ni-Sn) Chip

Pin

(Ag) : PLASTIC PAG Chip Stage Inner Pattern Ag Coating

(Au) : Wire Bonding Wire .

1. IC

1. IC Maker

1) : IC

2) : Package

3) : IC Al().( )

4) : IC SiO2

2. Set Maker(User)

1) EOS(Electrical Over Stress)

,(Surge) IC IC . Jig L,C

. TV check IC

. CPT PCB Assy 180V , (Main2,SMPS)

.

2) Latch up

MOS(Micom) IC IC .5V Micom 12V VDD,D

in,out Micom VDD Ground(VSS) IC . Latch

12V . Latch up IC IC .

3) Soft Error

Micom IC Program Error . Micom ESD,Soft Error .

4) ESD(Electronic static discharge)

() 4 (model) .

HBM(Human body model, ) CDM(Charge devide model,)

FIM(Field induced model,) MM (Machine model,)

2. IC MODE

. ESD?

1. ESD()

2. ESD

1. ESD(Electronic ststic discharge,)

1) ESD?

. .

.

Positive() , Negative () .

,

Key .

2)

Asbestos

Acetape

Nylon

Wool

Silk

Wax

Nikel

Polyester

PVC

Rubber

Positive()

Negaitive()

(0)

(0)

2. ESD ?

EDS . .

10 %

40 %

55 %

1 Carpet 35KV 15KV 7.5KV

2 12KV 5KV 3KV

3 6KV 0.8KV 0.4KV

4 PCB Bubble Pack 26KV 20KV 7.5KV

5 Roll 11KV 4KV 2KV

E V E N T

* 40% 0.8KV .

1. ESD()

3. IC ?

4. ESD

1. ESD()

IC IC . IC HBM . HBM .

1. HBM(Human body model,)

1)

Cb

Rb

Rd

IC

Rc

contact

* () . IC .

IC Diode

Cb(capacitor of body, ) : 100 ~ 200 pF

Rb(resister of body, ) : ( 100 ~200), ( 1 ~ )

2) (power,energy) ?

E = CV

1

2

2

)

Cb = 100 ~200pF, V = 6KV E = 1/2CV2 = 0.5 20010-12 60002 = 3.6mJ

2. ESD()

3) IC maker ()

EIAJ

MIL STD 883

SPEC

R = 0, C = 200 pF

R = 1K, C = 200 pF

200V

1KV

energy 3.6mJ IC 4.0uJ IC 900 .

*.IC Maker IC energy?

Cb = 200pF, V = 200V

E = 1/2CV2 = 0.5 20010-12 2002 = 4.0uJ

2. CDM(Charged device model,)

. IC IC SET Maker IC

IC IC .

IC Stick() .

1) IC ESD .

2), .

2. ESD()

3. HIM(Field induced model,)

IC Electrical Field(,) IC IC IC Data

. Micom Micom data 0 -> 1 Micom .VCR Micom

TV Micom Error TV CPT , .

1) Toshiba Micom FIM Micom Shield CPT

Micom data Error .

2) Know How IC Connector

CPT .

3)TV NC-01J TOSHIBA Micom HIM

Micom Shield . Shield NC-01J

Micom 80% .

4. MM(Machine model,)

IC .

IC IC IC .

2. ESD()

. ESD()

1. ESD()

2. ESD

3. Surge

4. Damage?

1-1. ESD Rule

1) IC ESD .

2) ESD IC .

3) Ststic-safe IC .

1-2. ESD

1) Conductive : ( 0 ~ 104/Square)

2) Static-Disspation(104~ 109 /Square)

3) Antistatic :(109 ~ 1012 /Square)

1. ESD() ?

1. ESD()

1.

1-1. Conductive ESD Ground .

1) (Wrist-Strap) : Ground .

(1) Ground .

.

Ground 1(10) , , .

- : 5 ,

- : 1

.

.

: 3M-716 type

2. ESD()

ESD Mat , 2 layer, 3

layer .

(): Static dissipative

():Conductive .(): .Mat : 3mm ~ 6mmMat 50mm .Mat .(1)

3)(Shose)

2)(Working Table)

()

()

(1)

1- 1M ~ 1G ( 0.1mJ :,)

2- 100K~10M( 0.1mJ:,)

TV 1. ()

Ground .

Ground

( )

(LG)

(LG

FAB)

2. ESD()

1-2. Static-Disspation

.

1)

. .

.

.

() .

*TV

1. : () .

2. ( )

: 50%, 50%, : 100%( )

3. 2 .

2)

.

2. ESD()

( ,) PP() .

BOX 20KV , BOX . BOX . BOX () .( 100V) BOX .

4) , ,PCBBOX(),BOX

.

1.BOX, Ground 2 BOX

.

3) ,,

, . .

1-3. Antistatic ,

.

1) IC

, IC Antistatic Stick IC .

Stick Maker 4 .

IC .

2. ESD()

1. EOS(Surge) ?

1-1. .

1. 1m, 2m .

2.

- :0.7mm, :900, :750mm

- :8mm,:900mm

3.

- 2.6mm, - 3.2mm

- 600V .

4.

1: 10

2: 100

2)

,, . .

.

A

B

C

D

( )

A

B

C

D

( )

3) TV

-.

Floating

A B C D E

()

*.: Floating A

.

*. : loof .

Main .

1)

3. SURGE

1-2. .

110V (-) Natural Ground

220V (+) G +110V,

(-) G -110V, 220V.

AC (-) 20V ~ 80V Noise

.

2) Trans

TV 1KW,300W 1KW .

1 2 .

2 GND GND .

* 2 .

3) DC POWER Supply

1.Power supply CC volume Max

2.PCB short PCB IC .

1) AC

3. SURGE

1-3. JIG, .

PCB check Power Off (N.C mode) PCB .

Fixture N.C mode PCB .

2)

touch .

1.2KV,3.6KV 1 .

( touch )

( touch)

t

()

t

Surge

(Arcing)

3) JIG

CPT PCB ASSY 180V IC ..

8V TOSHIBA VCD IC .( Data)

* 8V ?

C = 4.7uF, V = 8V E = 1/2CV2 = 0.5 4.710-682 = 150uJ

TOSHIBA VCD IC 36uJ 5 . TV

uF ESD 200pF 5,000 . IC

.

4) Anode JIG

* Anode ?

C = 3000pF, V = ?V E=36uJ

E = 1/2CV2 , V2 = 2 E C = 236u 3000p = 24,000 , V = 155V

150V , IC Maker ESD 51V .

1) (AFT,VCO...)

3. SURGE

5) Fixture(APC,Check)

Chattering

Pin Noise .

()

()

Chattering

Chassis

-.Jig Fixture GND pin , GND pin pin

GND check .

APC Check Mode IC Pin

-. IC PIN DIRECT CHECK MODE .

-.IC PIN JIG JIG Pin Mode .

-.IC CHECK RANGE 10-5/10-6 .

-.IC Vcc +,GND - CHECK ( 1mA )

1) RELAY (SURGE) IC .(RELAY SURGE )

2) CHECK RELAY BOX RELAY BOX 2EA CHECK 1EA 10V SURGE 10V SURGE

(3~8V ) .

6) RELAY Noise IC

2V 50mS

10V

RELAY

implse

3. SURGE

CPT PCB

180V

SMPS

1

SMPS

2

FBT

C1

C2

100/16

C3

470/250

STR

C2/C3

-. :2.5V / SEC

Time

. MAIN PCB CPT PCB 180V LINE SMPS 2 10 ~ 20V

IC

7) SMPS 2 B+ PCB 180V

8) PALLET

. 8-LINE CONVEYOR PALLET ROLLER TV SET LINE DAMAGE .

-. LINE CONVEYOR ROLLER PALLET .

-. 200 ~300V ROLLER 20 ~ 60 SEC .

-.Pallet Brush .

-.Pallet Rollor

PCB Touch IC

3. SURGE

*PALLET

SPARK (700V )

(pallet brush )

10 20 30 40 50 sec0

130

100

50

Cooling

150v

(impulse)

. Cooling

. LOOP

Resonator 150V

Impulse IC

.

9) Resonator impulse IC

Cooling Resonator 150V Impulse IC IC .

.LINE

Soldering M/C

*Cooling

- Fan 2ea

*Line

Damage .

ic

( 60 ~ 70 )

3. SURGE

1. Damage?

LASER ,PACKAGE IR-REFLOW

VPS . PKG CRACK DELAMINATION

WIRE .

1)PACKAGE CRACK MECHANISM

MOISTURE PROOF BAG OPEN

PACKAGE .

PACKAGE (PV = nRT) PACKAGE

.(ex, 215 21 )

PACKAGE ,

CRACK , .

CRACK .

CRACK

SOLDER

REFLOW

4. DAMAGE?

1

. IC

1. IC

4)Liquid Crystal

-.DE-CAP Pattern

Liquide Crystal (5V) .(Bip Tr Junction )

5)EMMI Test

-.EMMI Eg Dector .

6)ETCHINING

-.Liquid Crystal Pattern Layer Etching .

7)Polishing

-.Liquid Crystal .

8)X-RAY

-.X-RAY Chip PKG Crack Wire Bonging .

9)Vcc & Freq TEST ( SHMOO Test)

-. Vcc & Freq IC Pin Function Check .

10)SAM(Scanning Aquastic Microscope)

-. Package Chip Gap Check.

11)

-. Plastic Package

PCB Test.

1)Test

-.IC / Curver Trace IC Spec Port

.

3)De-Cap

-.(Nitric Acid FUMING) Epoxy Chip Pattern ,

Crack . ESD,EOS .

2)IC

-.TV Set IC Test (MAKER Sampleing )

1.

1. IC

2. ESD Test

IC ESD Test

1).IC Set ESD Test ESD .

-. - 250 V

-. +800 V .

1-1)

IC

Set ESD Test

-. - 500 V

-. +1200 V .

Set ESD Test

-. 100 : - 700 V, 1K: -1100V

-. 100 : + 3400 V, 1K: +4600V

.

IC

75

2-1)

3-1)

IC

75

R

Set Diode ESD Test

-. -900V

-. +4600V

.

IC

75

4-1)

Set /Diode ESD Test

-. -1600V

-. +5000V

.

IC

75

5-1)

100

1. IC

3. IC Junk Cutting

1) Soldering IC Junk Set

IC Junk

-.Spec : 0.25mm .

Junk Spec Spec .

Junk Cutting -.Punch Life Time : 10 Strok 8 Stroke

** Flux .

-. Alcoho Cleaning Junk 1/2 .

-. .

4. Metal, Contact Open

1) Fab Mask Defect Etching Oxide Metal, Contact Open

-. Contact Open Vout Down.

. IC

Contact Open( )

. IC

Contact Open( )

1. IC

1