array 工艺技术
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Array 工艺技术. BOEOT QA/ OQA 董国梁 2009 . 03 . 15. 1·Array 工艺构成流程 2· 5Mask 工艺流程 3· 4Mask 工艺流程 3.1 Gate process 3.2 SDT process 3.3 PVX process 3.4 ITO process 4· 4Mask&5Mask 工艺比较. 目录. Array 工艺构成. Mask 工艺流程. Light. Photo Resist. Photo Mask. Thin Film. Photo Resist. Glass. - PowerPoint PPT Presentation
TRANSCRIPT
1
Array
Mask
5Mask
PR
PR
Glass
Glass
5Mask
AFST01
AFST08
AFST04
AFST03
AFST02
AFST09
AFST11
AFST12
AFST14
AFST10
AFST07
A3
A1
A2
AFST13
AFST15
AFST18
EV
ATGT01
AEWS07
4Mask--
glass
Roll Brush3µmSW
Suction Bubble JetDI waterbubbleparticle3∼5 µmparticleBJ
AQK(aqua knife)slitNozzleDIWfinal cleaning
AKair knife AKslit Nozzleslit nozzle
1. Unpack & Initial Clean
glass
sputter
2. Gate Deposition
2. Gate Deposition --- Sputter
THIN FILM,2Glow Discharge
Sputter Chamber
Transfer Chamber
L/UL Chamber
Transfer System
TFT patternTFT patternTFT pattern.
3. Gate Mask --- Cleaning
PRPRMura
Spray, 5
3. Gate Mask --- Bake
PR
Slit
3. Gate Mask --- Interface
3. Gate Mask --- Aligner
MIRROR PROJETION MASK ALIGNER(MASK
glass
mask
3. Gate Mask --- Developer
DeveloperPR
4. Gate Wet Etch
4. Gate Wet Etch
4. Gate Wet Etch
Al 4AL +2HNO3 → 2AL2O3 + N2 + H2
H3PO4 + AL2O3 → AL(PO4) + H2O
H3PO4 + Mo2O3 → Mo(PO4) + H2O
Type: Spray , Spray , Spray
gate
glass
SiNXSiH4NH3,
n+ a-Si:HSiH4PH3
PECVD
a-Si:H
(2) a-SiNx:Hi. ii.
(3) n+ a-Si
---
---
glass
--- CleaningPT
SD LayerMO
GT Exposal Develop
glass
glass
Active Etch-Dry Etch
---SD
glass
Ashing
glass
glass
glass
1. Pre Dep. Clean
4Mask-PVX process
glass
3. VIA Mask
VIA Hole Wet Strip
1. Pre Dep. Clean
4Mask-ITO process
glass
Glass
Pixel
Data
QA/OQA
DGL
Array
Mask
5Mask
PR
PR
Glass
Glass
5Mask
AFST01
AFST08
AFST04
AFST03
AFST02
AFST09
AFST11
AFST12
AFST14
AFST10
AFST07
A3
A1
A2
AFST13
AFST15
AFST18
EV
ATGT01
AEWS07
4Mask--
glass
Roll Brush3µmSW
Suction Bubble JetDI waterbubbleparticle3∼5 µmparticleBJ
AQK(aqua knife)slitNozzleDIWfinal cleaning
AKair knife AKslit Nozzleslit nozzle
1. Unpack & Initial Clean
glass
sputter
2. Gate Deposition
2. Gate Deposition --- Sputter
THIN FILM,2Glow Discharge
Sputter Chamber
Transfer Chamber
L/UL Chamber
Transfer System
TFT patternTFT patternTFT pattern.
3. Gate Mask --- Cleaning
PRPRMura
Spray, 5
3. Gate Mask --- Bake
PR
Slit
3. Gate Mask --- Interface
3. Gate Mask --- Aligner
MIRROR PROJETION MASK ALIGNER(MASK
glass
mask
3. Gate Mask --- Developer
DeveloperPR
4. Gate Wet Etch
4. Gate Wet Etch
4. Gate Wet Etch
Al 4AL +2HNO3 → 2AL2O3 + N2 + H2
H3PO4 + AL2O3 → AL(PO4) + H2O
H3PO4 + Mo2O3 → Mo(PO4) + H2O
Type: Spray , Spray , Spray
gate
glass
SiNXSiH4NH3,
n+ a-Si:HSiH4PH3
PECVD
a-Si:H
(2) a-SiNx:Hi. ii.
(3) n+ a-Si
---
---
glass
--- CleaningPT
SD LayerMO
GT Exposal Develop
glass
glass
Active Etch-Dry Etch
---SD
glass
Ashing
glass
glass
glass
1. Pre Dep. Clean
4Mask-PVX process
glass
3. VIA Mask
VIA Hole Wet Strip
1. Pre Dep. Clean
4Mask-ITO process
glass
Glass
Pixel
Data
QA/OQA
DGL
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