chapter 2m09408034/cae/semiconductor/chapter 2... · chip technology. 23 why need fc technology ?...
TRANSCRIPT
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Chapter 2Chapter 2Interconnection TechnologyInterconnection Technology
(Zero(Zero--level package)level package)
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Introduction of Wire Bond TechnologyIntroduction of Wire Bond Technology
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Category of Wire BondCategory of Wire Bond1957, Bell Lab.
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Category of Wire BondCategory of Wire Bond
銲接種類 超音波銲接Ultrasonic Bonding
熱壓銲接Thermocompression
Bonding
熱音波銲接Thermosonic
Bonding能量種類 超音波 熱、壓力 熱、壓力、超音波
線材 Al-1%Si銲線 Au銲線 Au銲線
打線條件
溫度 室溫 330 ~ 350℃ 150 ~ 200℃
荷重 小 大 中
時間 0.4 ~ 0.6 s/wire 0.15 ~ 0.4 s/wire 0.1 ~ 0.3 s/wire
超音波 有 無 有
方向性 有 無 無
備考 使用純鋁線 過去使用 目前使用
1. Wire diameter: 25 ~ 75 um (1~3 mil)2. Sonic frequency: 20~120 kHz
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Thermosonic Thermosonic BondingBonding
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Thermosonic Thermosonic BondingBonding
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Ultrasonic BondingUltrasonic Bonding
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Ultrasonic BondingUltrasonic Bonding
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Qualification CheckQualification Check
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Qualification CheckQualification Check
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WB QFP Process FlowWB QFP Process Flow
Wafer Saw Die Bonding
Molding
Wire BondingTrimming & Forming
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WB QFP/BGA Process FlowWB QFP/BGA Process Flow
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WB Package FamilyWB Package Family
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Introduction of FlipIntroduction of Flip--chip Technologychip Technology
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Why Need FC Technology ?Why Need FC Technology ?
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Advantages of Flip ChipAdvantages of Flip Chip
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Advantages of Flip ChipAdvantages of Flip Chip
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What is Flip Chip ?What is Flip Chip ?
With underfill FC: organic substrateWithout underfill FC: ceramic substrate
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Bumping Process (Evaporation)Bumping Process (Evaporation)
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Bumping Process (Electroplating)Bumping Process (Electroplating)
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Bumping Process (Printing)Bumping Process (Printing)
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FC BGA/CSP Process FlowFC BGA/CSP Process Flow
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FC Assembly FlowFC Assembly Flow
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Wafer thickness: 6~8 mils (152.4~203.2 um)12’ wafer: may not have backside grinding due to avoid wafer crack
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FC Assembly FlowFC Assembly Flow
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FC Assembly FlowFC Assembly Flow
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FC Assembly FlowFC Assembly Flow
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FC Assembly FlowFC Assembly Flow
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Reflow ProfileReflow ProfileEutectic solder 240 CLead free solder 260 C
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FC Family PackagesFC Family Packages
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Introduction of Tape Automatic Introduction of Tape Automatic Bonding TechnologyBonding Technology
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Application of TCP Packaging TechnologyApplication of TCP Packaging Technology
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Definition of TCPDefinition of TCP
‘TCP’ is a connection technique for attaching Au bumped semiconductor die to the tape (polyimide film which is patterned with conductor).
• TCP : Tape Carrier Package• COG : Chip On Glass• TAB : Tape Automated Bonding
TCP ( Tape Carrier Package )
Flex Hole Flex CoatAdhesive ICBump
Solder Resist
Base Film
Cu
3 layer Flm
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LCM Module LCM Module
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TCP Cross Section TCP Cross Section
BASE Film - Upilex-S- Thickness : 75um
Adhesive- Toray#7100,#8200, TomegawaE,X- Thickness : 12um
Au Bump- Thickness : 15~25um- Ave : 18 um
Drive IC
Solder Resist- AE-70-M11- AR7100- CCR232GF- SPI1000- Thickness : 20+/-15um
Tin Plating ( Sn )- Thickness : 0.2+/-0.1um
ILB Bond
POTTING- Epoxy Resign
Copper ( Cu )- FQ-VLP- FX-VLP- 3EC-VLP- SLP- Thickness : 15, 18, 25um
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TCP Tape Structure TCP Tape Structure
Input outer leadAlignment Hole
Sprocket Hole
Test pads for output signal
Inner lead
OLB AlignmentMark
Cut-linefor User Application
Slit hole(Bending Position)
ILB AlignmentMark
Solder resist Area
Product Name
TP
Output outer lead
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Tape Design Tape Design
Tape width: 35W, 35SW, 48W, 48SW, 70W
Perforation: 2pf, 3pf, 4pf, 5pf,………
Min. pitch: 45um, 50um, 55um,…….
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Tape Manufacture Tape Manufacture
Puncher Mask for tape O/S checker
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Gold Bump Process Gold Bump Process
LSI WAFER
RESIST Coating
UBM Sputtrting
RESIST Patterning
UBM ETCHING
RESIST Stripping
Au PLATING
- Provide the proper metallurgy for the ILB- Provide a standoff preventing the TAB lead
from shorting to the edge of the die- Protect the underlying aluminium from
corrosion or contamination
Passivation UBM(Ti/w)
BUMP
Bump SizeBump Clearance
Pad Metal (Al)
Bump Height
The Purpose of BUMP
Control Factors- Bump Height & Hardness- Bump Shear Strength- Bump Size & Shape [Flatness]
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Wafer Testing Wafer Testing
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Process Flow of TCPProcess Flow of TCP
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Process Flow of TCPProcess Flow of TCP
DicingProcess of cutting the water into pieces by using the diamond blade turning at high speed
Inner LeadBonding
Process of combining gold bump and inner lead of film on the basis of appropriate time, pressure, and temperature by using the ILB tool.
Potting Process of spreading the liquid resin on the surface of the chip to protect it.
Test Process of probing the electrical condition of products.
VisualInspection
Process of packing products and finally checking the outer condition of the product
MarkProcess of printing a character on the surface of the device which is potted. The character is composed of the device name and production work week.
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ILB ( Inner Lead Bonding ) ILB ( Inner Lead Bonding )
Inner Lead Bonding is to form a strong metallugical bond between the die (bump) and the carrier tape (plated copper with Sn or Au)
Bond ForceBond TimeBond TempStage Temp
Bump Height & Bump HardnessBump Shape & Contamination
Thermode FlatnessThermode Temperature StabilityRecognition & Alignment Accuracy
Inner lead Width & ThicknessPlating Thickness[Pure Sn]
Parameter Control Factors
Eutectic Bond / Gang Bond (Constant Heat)
Bonding Method
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Potting ProcessPotting Process
Pre Cure : 120℃ / 25min Post Cure - 5020 : 120℃ / 4hr- 8151 : 150℃ / 1hr
Chip coat viscosity & Inner lead PitchTape Warpage Cure ConditionNeedle SizeNeedle Height & SpeedPressure
Epoxy Type Chip coatType : 5020(HITACHI) / 8151 (NAMICS)
Coating Pattering(Teaching points)Dispensing SpeedPressure
Parameter Control Factors
Cure Condition
Material
Potting is a process to encapsulate IC in order to protect inner lead bonded ICfrom external contamination or mechanical stress.
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Marking Process Marking Process
Marking is to print a character on the surface of the device which is potted.The character is composed of the device name and production work week.
UV Cure Time
Tape WarpageUV Cure ConditionPosition Sensor / Clamp Alignment Location
Ink : 9065 (Markem)
Laser SpeedLaser FrequencyPower ( Intensity of Laser )
Parameter Control Factors
Material
Ink Marking
Laser Marking
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Final Testing Final Testing
• F/T probe card
• F/T push plate
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FMEA SystemFMEA System
Failure Analysis System
Decap Equipment X-RaySEMEDXCross Section
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TCP Family PackagesTCP Family Packages