March 2014 Quarterly Reliability Report Document Number DOC-60021, Revision 1

Document No. DOC-60021-01 Page 2 of 25

Table of Contents

Peregrine Semiconductor Reliability System 3 Failure Rate Calculation Acceleration Factor 4 Failure in Time Calculation 5 Reliability Results (FITs) 6 Process Technology Classification ULTRACMOS

® 2 Process (U500E) 7

ULTRACMOS® 3.5 Process (U350E) 8

ULTRACMOS® 5 Process (U350B) 9

ULTRACMOS® 6 Process (U250E) 10

ULTRACMOS® 6.5 Process (U250E) 11

ULTRACMOS® 8 Process (U250B) 12

Product Family Classification Antenna Switches (ASW) 13 High Performance Switches (HPSW) 14 Digitally Tunable Capacitors (DTC) 15 Digital Step Attenuators (DSA) 16 DC-DC Buck Regulators/Converters (DCDC) 17 Mixers (MXR) 18 Phase Locked-Loop Synthesizers (PLL) 19 Prescalers (PSR) 20 Power Limiters (LMTR) 21 Reliability Data (Periodic Testing - 8 QTRs) 22 High Temperature Operating Life (HTOL) 23 Temperature Cycle (TC) 24 Highly Accelerated Stress Test (HAST) 25 High Temperature Storage (HTS) 26

Document No. DOC-60021-01 Page 3 of 25

Peregrine Semiconductor Reliability System

The Quarterly Reliability Report is a compilation of reliability stress test results that crosses the entire product & technology family of Peregrine Semiconductor Corporation products. Data is collected on a regular basis through the efforts of product and process qualifications, standard product monitoring and lot acceptance testing. To date, a total of 32,793 devices have been tested in HTOL with a total of 3 billion equivalent device hours. The overall failure rate for the PSC family of products is 0.31 FIT at 55°C and 60% UCL. Peregrine Semiconductor reliability testing standards conform to industry standard qualification procedures as detailed in the JEDEC and/or Military Standard guidelines. In addition, where clear guidelines have not been established yet, Peregrine Semiconductor has developed stringent reliability requirements to ensure consistent high reliability performance. Peregrine Semiconductor makes use of accelerated life testing results, along with thermal acceleration factors in the prediction of failure rates. High Temperature Operating Life (HTOL) stress testing is performed at accelerated voltage and temperature conditions which are based on MIL-STD-883 M1005.9 and Jedec JESD22 A108 standards. Resulting data collected from HTOL tests is de-rated (accelerated) to a typical operating temperature of 55°C. Early Life Failure Rate (ELFR) is derived after 48-hr performance. Peregrine Semiconductor conducts an ongoing product reliability monitoring program to evaluate sample products from high volume, major product families on a quarterly basis. The reliability monitoring process is a continuously improving system within Peregrine Semiconductor as we strive for superior product knowledge and performance. Peregrine Semiconductor performs the majority of reliability testing using an ISO17025 certified test laboratory located in San Jose, California. Regular auditing of the laboratory is performed to ensure compliance to ISO standards.

Document No. DOC-60021-01 Page 4 of 25

Failure Rate Calculation

Acceleration Factor

An acceleration factor is a constant, which expresses the enhanced effect of temperature on a device’s failure rate used in reliability prediction formulas. The typical purpose is to show the acceleration effect between the failure rates at two different temperatures. The semiconductor industry uses the thermal acceleration factor formula based on Arrhenius equation noted below:

where:

e = base of the

natural logarithm

Ea = Activation energy

k = Boltzmann’s constant

T1 = test temperature in Kelvin

T2 = use temperature in Kelvin

Sample Calculation

T1 = 55oC + 273.15 = 328.15

oK

T2(125) = 125oC + 273.1 = 398.15

oK

AF(125) = exp [(0.7 / (8.617 x 10–5

)) x ((1/328.15 – 1/398.15))] = 77.6 @125°C

T2(150) = 150oC + 273.1 = 423.15

oK

AF(150) = exp [(0.7 / (8.617 x 10–5

)) x ((1/328.15 – 1/423.15))] = 259.2 @150°C

Document No. DOC-60021-01 Page 5 of 25

Failure Rate Calculation (continued)

Failure in Time Calculation

Mean time to failure (M.T.T.F.) is defined as the average time it takes for a failure to occur. Failure in Time (F.I.T.) is the number of units predicted to fail in a billion (1e

9)

device hours at a specified temperature. After the life test is completed and accelerated device hour data is calculated, the failure rate is estimated using the Chi-Square approximation (χ

2) as follows:

where:

χ2 = chi square function

r = number of failures

EDH = equivalent device hours (units tested x test hours x AF)

Sample Calculation

Given: Units Tested (Sample Size) = 231 devices

Test temperature = 150°C

Test duration = 500 hours

Failures = 0

EDH = (231 x 500 x 259.2) = 2.99E+7 equivalent device hours

χ2 @ 60% confidence level and 0 failures = 1.83

FIT (60% confidence level) = [1.83 / (2 x 2.99E+7)] x 1.0E+9 = 30.6 FIT

Reliability ResultsResultsResults (FITs)(FITs)(FITs)

Document No. DOC-60021-01 Page 7 of 25

ULTRACMOS® 2 Process Technology

Generation 500 nm CMOS Silicon Epi Process (U500E) :

Units Tested 19,122 :

Product Family ASW, HPSW, DSA, DC-DC, MXR, PLL, PSR, :

Equivalent Device Hours (EDH) FITs MTTF (hours)

1.38E+08 6.7 1.50E+08

1.59E+09 0.6 1.75E+09Constant (Random)

Standard Failure Rate Calculations at 55°C and 60% CL

Early Life

0.10

1.00

10.00

100.00

1000.00

25 50 75 100 125 150

FIT

Junction Temperature (°C)

Constant Failure Rate as a Function of Junction Temperature

60% CL

90% CL

Document No. DOC-60021-01 Page 8 of 25

ULTRACMOS® 3.5 Process Technology

Generation 350 nm CMOS Silicon Epi Process (U350E) :

Units Tested 6,973 :

Product Family ASW, HPSW, DTC, DSA, PSR :

Equivalent Device Hours (EDH) FITs MTTF (hours)

8.59E+07 10.7 9.38E+07

5.84E+08 1.6 6.41E+08

Standard Failure Rate Calculations at 55°C and 60% CL

Early Life

Constant (Random)

0.10

1.00

10.00

100.00

1000.00

10000.00

25 50 75 100 125 150

FIT

Junction Temperature (°C)

Constant Failure Rate as a Function of Junction Temperature

60% CL

90% CL

Document No. DOC-60021-01 Page 9 of 25

ULTRACMOS® 5 Process Technology

Generation 350 nm CMOS Bonded Silicon Process (U350B) :

Units Tested 4,385 :

Product Family ASW, HPSW, DTC, PLL, LMTR :

Equivalent Device Hours (EDH) FITs MTTF (hours)

5.43E+07 16.9 5.93E+07

5.77E+08 1.6 6.33E+08

Standard Failure Rate Calculations at 55°C and 60% CL

Early Life

Constant (Random)

0.10

1.00

10.00

100.00

1000.00

10000.00

25 50 75 100 125 150

FIT

Junction Temperature (°C)

Constant Failure Rate as a Function of Junction Temperature

60% CL

90% CL

Document No. DOC-60021-01 Page 10 of 25

ULTRACMOS® 6 Process Technology

Generation 250 nm CMOS Silicon Epi Process (U250E) :

Units Tested 1,032 :

Product Family ASW :

Equivalent Device Hours (EDH) FITs MTTF (hours)

8.35E+06 109.8 9.11E+06

8.55E+07 10.7 9.34E+07

Standard Failure Rate Calculations at 55°C and 60% CL

Early Life

Constant (Random)

0.10

1.00

10.00

100.00

1000.00

10000.00

25 50 75 100 125 150

FIT

Junction Temperature (°C)

Constant Failure Rate as a Function of Junction Temperature

60% CL

90% CL

Document No. DOC-60021-01 Page 11 of 25

ULTRACMOS® 6.5 Process Technology

Generation 250 nm CMOS Silicon Epi Process (U250E) :

Units Tested 305 :

Product Family ASW :

Equivalent Device Hours (EDH) FITs MTTF (hours)

3.79E+06 241.9 4.13E+06

3.88E+07 23.6 4.23E+07

Standard Failure Rate Calculations at 55°C and 60% CL

Early Life

Constant (Random)

0.10

1.00

10.00

100.00

1000.00

10000.00

100000.00

25 50 75 100 125 150

FIT

Junction Temperature (°C)

Constant Failure Rate as a Function of Junction Temperature

60% CL

90% CL

Document No. DOC-60021-01 Page 12 of 25

ULTRACMOS® 8 Process Technology

Generation 250 nm CMOS Bonded Silicon Process (U250B) :

Units Tested 886 :

Product Family ASW, LMTR :

Equivalent Device Hours (EDH) FITs MTTF (hours)

1.10E+07 83.3 1.20E+07

1.15E+08 8.0 1.26E+08

Standard Failure Rate Calculations at 55°C and 60% CL

Early Life

Constant (Random)

0.10

1.00

10.00

100.00

1000.00

10000.00

25 50 75 100 125 150

FIT

Junction Temperature (°C)

Constant Failure Rate as a Function of Junction Temperature

60% CL

90% CL

Document No. DOC-60021-01 Page 13 of 25

ANTENNA SWITCHES (ASW)

Description Multi-pole & multi-throw high power handling antenna

switch products for Mobile Wireless RF and Test

Equipment /ATE applications.

:

Products in Family PE4211x, PE421230, PE421240, PE4255x, PE426x,

PE4261x, PE42614x, PE42615x, PE42616x, PE42617x,

PE4263x, PE42641, PE4266x, PE4267x, PE4268x,

PE42682x, PE42684x, PE42685x, PE4269x, PE42695x,

PE42688x, PE421510, PE421550, PE42162x, PE42128x,

PE42129x, PE42159x, PE636030, PE636040

:

Process Technology UltraCMOS® 2, UltraCMOS

® 3.5, UltraCMOS

® 5,

UltraCMOS® 6, UltraCMOS

® 6.5, UltraCMOS

® 8

:

Units Tested 6,918 :

Equivalent Device Hours (EDH) FITs MTTF (hours)

8.26E+07 11.1 9.02E+07

8.58E+08 1.1 9.43E+08

Standard Failure Rate Calculations at 55°C and 60% CL

Early Life

Constant (Random)

0.10

1.00

10.00

100.00

1000.00

25 50 75 100 125 150

FIT

Junction Temperature (°C)

Constant Failure Rate as a Function of Junction Temperature

60% CL

90% CL

Document No. DOC-60021-01 Page 14 of 25

HIGH PERFORMANCE SWITCHES (HPSW)

Description High performance switch products for wireless RF,

broadband and high reliability space switch applications.

:

Products in Family PE33241, PE4210, PE4220, PE423x, PE424x, PE4242x,

PE425x, PE42520, PE4254x, PE427x, PE42721,

PE42742, PE42750, PE428x, PE42820, PE84140,

PE84244, PE94257, PE9354, PE9542x, PE42359,

PE42850, PE423422

:

Process Technology UltraCMOS® 2, UltraCMOS

® 3.5, UltraCMOS

® 5 :

Units Tested 12,414 :

Equivalent Device Hours (EDH) FITs MTTF (hours)

1.34E+08 6.8 1.46E+08

1.01E+09 0.9 1.11E+09Constant (Random)

Standard Failure Rate Calculations at 55°C and 60% CL

Early Life

0.10

1.00

10.00

100.00

1000.00

25 50 75 100 125 150

FIT

Junction Temperature (°C)

Constant Failure Rate as a Function of Junction Temperature

60% CL

90% CL

Document No. DOC-60021-01 Page 15 of 25

DIGITALLY TUNABLE CAPACITORS (DTC)

Description Supports a wide range of tuning applications, from tuning

the center frequency of mobile-TV and antennas, to

tunable impedance matching and filters.

:

Products in Family PE6230x, PE621010, PE621020, PE623060, PE623090,

PE6490x, PE6410x, PE613040

:

Process Technology UltraCMOS® 3.5, UltraCMOS

® 5 :

Units Tested 1,691 :

Equivalent Device Hours (EDH) FITs MTTF (hours)

2.10E+07 43.6 2.29E+07

2.14E+08 4.3 2.34E+08Constant (Random)

Standard Failure Rate Calculations at 55°C and 60% CL

Early Life

0.10

1.00

10.00

100.00

1000.00

10000.00

25 50 75 100 125 150

FIT

Junction Temperature (°C)

Constant Failure Rate as a Function of Junction Temperature

60% CL

90% CL

Document No. DOC-60021-01 Page 16 of 25

DIGITAL STEP ATTENUATORS (DSA)

Description 50Ω and 75Ω Digital Step Attenuators for wireless

infrastructure, microwave, test equipment and high

:

Products in Family PE430x, PE4320x, PE43404, PE4350x, PE4360x,

PE4370x, PE94302, PE4312

:

Process Technology UltraCMOS® 2, UltraCMOS

® 3.5, UltraCMOS

® 5 :

Units Tested 2,014 :

Equivalent Device Hours (EDH) FITs MTTF (hours)

1.68E+07 54.4 1.84E+07

1.95E+08 4.7 2.13E+08Constant (Random)

Standard Failure Rate Calculations at 55°C and 60% CL

Early Life

0.10

1.00

10.00

100.00

1000.00

10000.00

25 50 75 100 125 150

FIT

Junction Temperature (°C)

Constant Failure Rate as a Function of Junction Temperature

60% CL

90% CL

Document No. DOC-60021-01 Page 17 of 25

DC-DC BUCK REGULATORS/CONVERTERS (DCDC)

Description These devices are radiation-hardened point-of-load (POL)

buck regulators with integrated switches suited for DC-DC

converter applications. This monolithic technology

replaces multi-chip modules by offering superior

performance, smaller size and reduced weight in sensitive

:

Products in Family PE9915x :

Process Technology UltraCMOS® 2 :

Units Tested 509 :

Equivalent Device Hours (EDH) FITs MTTF (hours)

2.10E+06 435.7 2.30E+06

1.73E+07 52.9 1.89E+07Constant (Random)

Standard Failure Rate Calculations at 55°C and 60% CL

Early Life

0.10

1.00

10.00

100.00

1000.00

10000.00

100000.00

25 50 75 100 125 150

FIT

Junction Temperature (°C)

Constant Failure Rate as a Function of Junction Temperature

60% CL

90% CL

Document No. DOC-60021-01 Page 18 of 25

MIXERS (MXR)

Description UltraCMOS MOSFET quad array broadband and tuned

mixers.

:

Products in Family PE412x, PE413x, PE414x, PE4150 :

Process Technology UltraCMOS® 2 :

Units Tested 783 :

Equivalent Device Hours (EDH) FITs MTTF (hours)

4.92E+06 186.1 5.37E+06

1.30E+08 7.1 1.42E+08Constant (Random)

Standard Failure Rate Calculations at 55°C and 60% CL

Early Life

0.10

1.00

10.00

100.00

1000.00

10000.00

25 50 75 100 125 150

FIT

Junction Temperature (°C)

Constant Failure Rate as a Function of Junction Temperature

60% CL

90% CL

Document No. DOC-60021-01 Page 19 of 25

PHASE LOCKED-LOOP SYNTHESIZERS (PLL)

Description Integer-N, Fractional-N and Delta Sigma Modulated

frequency synthesizers for base station, mobile wireless

and high reliability space applications.

:

Products in Family PE323x, PE3240, PE329x, PE333x, PE334x, PE8334x,

PE960x, PE970x, PE972x, PE97240, PE9763, PE33241

:

Process Technology UltraCMOS® 2, UltraCMOS

® 5 :

Units Tested 5,629 :

Equivalent Device Hours (EDH) FITs MTTF (hours)

2.77E+07 33.0 3.03E+07

3.87E+08 2.4 4.24E+08Constant (Random)

Standard Failure Rate Calculations at 55°C and 60% CL

Early Life

0.10

1.00

10.00

100.00

1000.00

10000.00

25 50 75 100 125 150

FIT

Junction Temperature (°C)

Constant Failure Rate as a Function of Junction Temperature

60% CL

90% CL

Document No. DOC-60021-01 Page 20 of 25

PRESCALERS (PSR)

Description UltraCMOS RF Prescalers. :

Products in Family PE350x, PE351x, PE8350x, PE8351x, PE930x, PE931x :

Process Technology UltraCMOS® 2, UltraCMOS

® 5 :

Units Tested 2,355 :

Equivalent Device Hours (EDH) FITs MTTF (hours)

1.15E+07 79.6 1.26E+07

1.68E+08 5.5 1.83E+08Constant (Random)

Standard Failure Rate Calculations at 55°C and 60% CL

Early Life

0.10

1.00

10.00

100.00

1000.00

10000.00

25 50 75 100 125 150

FIT

Junction Temperature (°C)

Constant Failure Rate as a Function of Junction Temperature

60% CL

90% CL

Document No. DOC-60021-01 Page 21 of 25

POWER LIMITERS (LMTR)

Description UltraCMOS Power Limiters. :

Products in Family PE45450, PE45140 :

Process Technology UltraCMOS® 5, UltraCMOS

® 8 :

Units Tested 480 :

Equivalent Device Hours (EDH) FITs MTTF (hours)

5.96E+06 153.7 6.51E+06

6.21E+07 14.8 6.78E+07Constant (Random)

Standard Failure Rate Calculations at 55°C and 60% CL

Early Life

0.10

1.00

10.00

100.00

1000.00

10000.00

25 50 75 100 125 150

FIT

Junction Temperature (°C)

Constant Failure Rate as a Function of Junction Temperature

60% CL

90% CL

Reliability DataDataData (Periodic Testing for the last 8 Quarters)(Periodic Testing for the last 8 Quarters)(Periodic Testing for the last 8 Quarters)

Document No. DOC-60021-01 Page 23 of 25

HIGH TEMPERATURE OPERATING LIFE (HTOL)

Reference Standards JESD22-A108, MIL-STD-883 M1005.9 :

Test Conditions TA = 125°C (A) or 150°C (B) :

Vbias = max operating voltage :

Test Duration (typical) 1,000 hrs. at (A) or 500 hrs. at (B) :

Note

n/a - Reliability data not available. Technology or product family not yet qualified at the specified period.

dash (-) - Test not performed at the specified period. RF HTOL may not apply to some products.

DC HTOL 2012 2012 2012 2013 2013 2013 2013 2014

Process Technology Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1

UltraCMOS® 2 0/1076 0/504 0/1611 0/2755 0/66 0/107 0/352 0/135

UltraCMOS® 3.5 0/509 0/240 0/609 0/346 0/283 0/581 0/170 0/2696

UltraCMOS® 5 0/460 0/768 0/240 0/255 0/203 0/598 - 0/955

UltraCMOS® 6 n/a n/a n/a 0/401 0/360 0/80 0/77 0/114

UltraCMOS® 6.5 n/a n/a n/a n/a n/a n/a 0/107 0/243

UltraCMOS® 8 n/a n/a n/a n/a n/a 0/646 - 0/240

UltraCMOS® 10 - - - - - - 0/90 -

DC HTOL 2012 2012 2012 2013 2013 2013 2013 2014

Product Family Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1

ASW 0/460 0/537 0/103 0/567 - 0/936 0/274 0/833

DCDC 0/188 0/22 0/111 - 0/22 0/22 - -

DSA - - 0/39 - 0/96 0/400 0/45 0/6

DTC 0/269 - 0/506 0/180 - 0/239 - -

HPSW 0/470 0/549 0/240 0/2994 0/728 0/181 0/192 0/3020

MXR - - - - - - - -

PLL 0/614 0/404 0/776 0/16 0/66 0/234 0/45 0/44

PSR 0/44 - 0/685 - - - 0/240 -

LMTR - - - - - - - 0/480

RF HTOL 2012 2012 2012 2013 2013 2013 2013 2014

Process Technology Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1

UltraCMOS® 2 - - - - - - - -

UltraCMOS® 3.5 0/32 - 0/64 - - 0/30 - -

UltraCMOS® 5 0/46 0/61 - 0/16 0/16 0/48 - 0/61

UltraCMOS® 6 n/a n/a n/a n/a - - - 0/32

UltraCMOS® 6.5 n/a n/a n/a n/a n/a n/a n/a 0/32

UltraCMOS® 8 n/a n/a n/a n/a n/a n/a - -

UltraCMOS® 10 - - - - - - 0/28 -

RF HTOL 2012 2012 2012 2013 2013 2013 2013 2014

Product Family Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1

ASW 0/46 0/61 0/32 0/64 - 0/125 0/59 0/125

DSA - - - - 0/16 - - -

DTC 0/32 - 0/32 - - - - -

HPSW - - - 0/16 - 0/16 - -

Document No. DOC-60021-01 Page 24 of 25

TEMPERATURE CYCLE (TC)

Reference Standards JESD22-A104 :

Test Conditions -55°C to +125°C (B) :

-65°C to +150°C (C) :

Test Duration (typical) 1,000 cyc. at (B) or 500 cyc. at (C) :

Note

n/a - Reliability data not available. Package (family) not yet qualified at the specified period.

dash (-) - Test not performed at the specified period.

* Plastic encapsulated packages had undergone MSL Preconditioning prior to test.

TC 2012 2012 2012 2013 2013 2013 2013 2014

Package Family Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1

8L 1.5x1.5 UDFN 0/286 - - - - - - -

10L 2x2 FCETSLP - - - - - - - -

10L 2x2 QFN n/a n/a 0/148 - - - - -

12L 2x2 QFN 0/299 0/299 - - - - - 0/300

12L 3x3 QFN - 0/290 - - - - - 0/360

16L 3x3 QFN n/a n/a n/a n/a 0/150 0/180 0/120 0/460

6L SC70 0/297 - - 0/240 - 0/57 - 0/55

20L 4x4 QFN - - - 0/135 - 0/180 - 0/179

24L 4x4 QFN - - - - - - - 0/55

32L 5x5 QFN n/a n/a - - - 0/135 - -

24L 4x4 QFN FCOLAM n/a - 0/492 - - - - -

32L 5x5 QFN FCOLAM n/a n/a n/a n/a n/a n/a - 0/301

8L TSSOP - - - - - - 0/283 -

32L 5x5 QFN n/a n/a n/a n/a - 0/135 - -

44L CQFP - - - - 0/15 - - -

Document No. DOC-60021-01 Page 25 of 25

HIGHLY ACCELERATED STRESS TEST (HAST)

Reference Standards JESD22-A110 :

Test Conditions 130°C, 85% RH, 2.27 atm. (A) :

110°C, 85% RH, 1.20 atm. (B) :

Test Duration (typical) 96 hrs. at (A) or 264 hrs. at (B) :

Note

n/a - Reliability data not available. Package (family) not yet qualified at the specified period.

dash (-) - Test not performed at the specified period. HAST may not apply to hermetic packages.

* Plastic encapsulated packages had undergone MSL Preconditioning prior to test.

HAST 2012 2012 2012 2013 2013 2013 2013 2014

Package Family Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1

8L 1.5x1.5 UDFN 0/135 - - - - - - -

10L 2x2 FCETSLP - - - - - - - -

10L 2x2 QFN n/a n/a 0/149 - - - - -

12L 2x2 QFN 0/135 0/135 - - - - - 0/599

12L 3x3 QFN - 0/291 - - - - - 0/348

16L 3x3 QFN n/a n/a n/a n/a 0/180 0/150 0/110 0/645

6L SC70 0/134 - - 0/238 - 0/58 - 0/55

20L 4x4 QFN - 0/135 - - - 0/178 - 0/179

24L 4x4 QFN - - - - - - - 0/55

32L 5x5 QFN n/a n/a - - - 0/166 - -

24L 4x4 QFN FCOLAM n/a n/a 0/150 - - - - -

32L 5x5 QFN FCOLAM n/a n/a n/a n/a n/a n/a - 0/180

8L TSSOP - - - - - - 0/285 -

32L 5x5 QFN n/a n/a n/a n/a n/a n/a n/a n/a

44L CQFP - - - - - - - -

Document No. DOC-60021-01 Page 26 of 25

HIGH TEMPERATURE STORAGE (HTS)

Reference Standards JESD22-A103 :

Test Conditions Ta = 150°C :

Test Duration (typical) 1,000 hrs. :

Note

n/a - Reliability data not available. Package (family) not yet qualified at the specified period.

dash (-) - Test not performed at the specified period.

HTS 2012 2012 2012 2013 2013 2013 2013 2014

Package Family Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1

8L 1.5x1.5 UDFN 0/300 - - - - - - -

10L 2x2 FCETSLP - - - - - - - -

10L 2x2 QFN n/a n/a 0/300 - - - - -

12L 2x2 QFN 0/300 0/300 - - - - - 0/298

12L 3x3 QFN - 0/300 - - - - - 0/269

16L 3x3 QFN n/a n/a n/a n/a - 0/300 - 0/555

6L SC70 0/298 - - 0/50 - - - -

20L 4x4 QFN - - - 0/77 - 0/299 - 0/300

20L 4x4 QFN - - - 0/77 - 0/299 - 0/300

32L 5x5 QFN n/a n/a - - - 0/77 - -

24L 4x4 QFN FCOLAM n/a - 0/240 - - - - -

32L 5x5 QFN FCOLAM n/a n/a n/a n/a n/a n/a - 0/297

8L TSSOP - - - - - - 0/298 -

32L 5x5 QFN n/a n/a n/a n/a - 0/77 - -

44L CQFP - - - - 0/22 - - -