status of the power electronics industry 2018 sample...4 report objectives •assess the market for...
TRANSCRIPT
From Technologies to Market
Status of the Power Electronics Industry
2018
SampleAugust 2018
2
Biography & contact
Dr. Ana Villamor, Technology & Market Analyst, Power Electronics & Compound Semiconductors
Dr. Milan Rosina, Senior Technology & Market Analyst, Power Electronics & Batteries
Dr. Milan Rosina is Senior Analyst, Power Electronics & Batteries, at Yole Développement (Yole), within the Power & Wireless division. Milan has 20 years ofscientific, industrial and managerial experience involving equipment and process development, due diligence, technology, and market surveys in the fields ofrenewable energies, EV/HEV, energy storage, batteries, power electronics, thermal management, and innovative materials and devices. He received his Ph.D. degreefrom National Polytechnical Institute (Grenoble, France). He previously worked for the Institute of Electrical Engineering in Slovakia, Centrotherm in Germany,Fraunhofer IWS in Germany, CEA LETI in France, and utility company ENGIE in France.
Contact: [email protected]
Dr. Ana Villamor serves as a Technology & Market Analyst, Power Electronics & Compound Semiconductors within the Power & Wireless division at YoleDéveloppement (Yole). She is involved in many custom studies and reports focused on emerging power electronics technologies at Yole Développement, includingdevice technology and reliability analysis (MOSFET, IGBT, HEMT, etc). In addition, Ana is leading the quarterly power management market updates released in2017. Previously Ana was involved in a high-added value collaboration related to SJ Power MOSFETs, within the CNM research center for the leading powerelectronic company ON Semiconductor. During this partnership and after two years as Silicon Development Engineer, she acquired a relevant technical expertiseand a deep knowledge of the power electronic industry. Ana is author and co-author of several papers as well as a patent. She holds an Electronics Engineeringdegree completed by a Master in micro and nano electronics, both from Universitat Autonoma de Barcelona (SP).
Contact: [email protected]
Alejandra Fuentes Suarez, Technology & Market Analyst, Power Electronics
Alejandra Fuentes Suarez is a Technology & Market Analyst, Power Electronics, within the Power and Wireless Team at Yole Développement (Yole). She isinvolved in the development of custom studies and reports covering the power electronics industry: Alejandra daily researches the latest developments in powerconverter topologies, passive components, power modules packaging and EV/HEV. Previously Alejandra acquired extensive expertise in the design of powerconverters for solar, wind, hydro and motor drive applications at Semikron (France). Alejandra graduated from UJF (Grenoble, FR) and INP (Grenoble, FR) as anelectrical engineer, specializing in design of power electronics system. She also holds an advanced master’s in the field of Marketing and Management of Energy fromthe Grenoble Business School (Grenoble, FR).
Contact: [email protected]
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ABB, Alpha and Omega Semiconductor (AOS), Amkor, Analog Devices, ASE Group, AT&S, AVX,
BMW Group, Bosch, BYD, Continental, Cree, CRRC, Danfoss, Delphi, Denso, Dialog Semiconductor,
Diodes Incorporated, DuPont Teijin Films, Dynex, EXAGAN, Fuji Electric, GaN Systems,
General Electric, GeneSiC, Global Wafers, Goldwind, Hitachi, Huawei, Infineon, Intel, Intersil,
Littelfuse, Macmic, Microchip, Microsemi, Mitsubishi Electric, Navitas, Nissan, NXP, Okmetic, ON
Semiconductor, Panasonic, Qualcomm, Renault, Renesas, Rohm, Sanken, Semikron, Shindengen,
Siemens, Silego Technology, ST Microelectronics, StarPower, STATSChipPAC, Sungrow, TDK, Tesla
Motors, Topsil, Toray, Toshiba, Toyota, Transphorm, TSMC, USCi, Vincotech, Vishay, Volkswagen,
Wolfspeed, and more.
COMPANIES CITED IN THE REPORT
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REPORT OBJECTIVES
• Assess the market for wafers, devices, modules and inverters
• Understand the market dynamics for the whole power electronics industry
• Identify the key drivers that will shape the market in the future
• To have an overview on the different components used in power electronics and its integration
• Understand the main technological challenges to overcome and the solutions developed so far
• Provide a clear overview of the different applications driving the power electronics business
• Present data ranking the power electronics industry leaders, describing supply chain consolidation,
the latest M&A activity and future trends in the power player landscape
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TABLE OF CONTENTS
• What is new vs what is updated? 9
• Executive summary 11
• Introduction• Main applications of power electronics
• Power vs frequency on electronics
• Packaging type by power inverter
• From silicon to application
• Substrate
• Semiconductor
• Discrete vs Power Module
• What is an inverter?
• Why innovation is so important
46
• Power electronics market
• Overall power electronics market
• Power wafer market• Wafer size trends
• 200 or 300 mm for power electronics?
• Enlarging wafer capacity?
• Wafer units evolution
• Wafer market by technology
61
• Power device market• Global Power Electronics market
• 2017-2023 By type of device
• Market shares per device
• Market share by voltage in 2017
• Main discrete Devices for Power Electronics
• Power MOSFET market metrics & forecasts• Key Power MOSFET markets
• Different market segment size and evolution
comparison
• Estimate of global power MOSFET market size 2017-
2023
• Comparison between 2017 and 2023 by application
• Estimation of total power MOSFET market including
module
• Estimation of total power MOSFET market without
module, voltage split
• IGBT market metrics & forecasts• Key Power IGBT markets
• IGBT market forecast by application from 2017
through 2023 in revenues
• IGBT technology status
• Split of IGBT packaged as discrete vs. modules
• Focus on IGBT module market and forecasts till 2023
• Why IGBT for rail applications decreases?
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TABLE OF CONTENTS
• Power ICs market• Power ICs annual revenue forecast by end market
• Power IC Market by component
• Power module market• Power module market forecast 2017-2023
• Comparison of module market shares by device type
• Inverter market• Inverter market evolution between 2017 and 2023
• How will different power ranges evolve?
• Inverter market evolution by application
• Power electronics drivers and evolution• Market growth context for the main power applications
• What device performance and what aspects need to be
improved?
• Material, semiconductor and power converter engineers
are working to find solutions
114
• Driving applications• MOSFET/IGBT required voltage per application
• Voltage summary by device and application
• Main applications driving power active components
122
• General trends• EV/HEV
• Wind
• Rail
• UPS
• Motor drive
• PV
• Consumer
• Audio/Image
• White goods
• Medical
• Computing & Storage
• Energy storage systems
• DC charging
126
• Focus on EV/HEV• Different types of electrified vehicles
• EV/HEV market evolution
• Which is the cost of the power components in a car?
• TOP 5 ranking Companies
• Sales in units split by electric car type
• EV/HEV converter market
• Geographical split of PHEV & BEV
• Geographical split of 48V systems
• EV/HEV Technology TRENDS
• How power converters are evolving
• Where can SiC & GaN be implemented?
• What is the advantage of SiC in each converter?
138
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TABLE OF CONTENTS
• Technology analysis
• Thermal management challenges• How to deal with heat in power electronic devices
• Evolution of junction temperature inside power
modules
• Thermal management challenges
• Sought-after power electronics cooling system
features
153
• Toward more integration in power
converters • Synergies and optimization of the power converter
components
• What technology developments will lead to high
power density?
• Higher integration new challenges
162
• Power stack• What is a power stack?
• Power stack characteristics
• How to assemble?
• Technology trends
• Power Stack market
• Market split by application in 2017 and 2023
• Business models
• Market shares
168
• Passive components
• Power capacitors• Power capacitor types
• Power Capacitor – focus on cooling
• Power capacitors – specific capacitors needed for
EV/HEV applications
• Key technology evolutions and roadmap
• Supply chain
• Power capacitor supply chain integration trends
181
• Inductors• Main functionalities of magnetic components in
power electronics environments
• Classification of the main magnetic materials used in
power electronics
• What is the industry looking for?
• Roadmap inductors
• Main magnetics manufacturers, by region
196
• Busbars• Connections classification
• Connection types
• Case studies
• Future technology trends
• Busbar roadmap
• Manufacturers by region
205
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TABLE OF CONTENTS
• Wide band gap devices• Wide band gap material
• Forecast through to 2023
• Market share by voltage in 2017
239
• SiC• SiC Power Device market revenue
• Market Share Evolution for different applications
• Different SiC Devices
• Which are the main areas of Development for SiC?
• SiC Reliability analysis
245
• GaN-on-Si• GaN Power Device market revenue
• Market Share Evolution for different applications
• Which are the main areas of Development for GaN?
• GaN power Discrete devices
• Technical challenges
• Commercial GaN Power Devices
254
• Other WBG materials for power• Figure-of-merit
• GaN-on-GaN
• Gallium Oxide
• AlN
• Diamond
264
• Battery and power electronics• Many battery application, one key driver
• Where are the opportunities for power electronics players?
• Trends
271
• Power electronics for harsh environment• Solutions at different levels
• Why is interest in solutions for harsh environment
growing?
• How to choose the best solution for harsh environment?
• Harsh environment challenges in different applications
• The origin of failures in power modules
• Main technology trends for harsh environment
279
• Power electronics landscape• Key players and power electronics landscape
• Revenues in 2017
• Geographical positions of main power semiconductor
companies
• Who is involved in each device?
• Power MOSFET market shares
• Module IGBT market shares
• Discrete IGBT market shares
297
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TABLE OF CONTENTS
• Power electronics companies financial
analysis• Littelfuse
• Infineon
• Texas Instruments
• ON Semiconductors
• ABB
• Vishay
• Renesas
• NXP
• ST Microelectronics
305
• Mergers & Acquisitions• Power electronics landscape evolution and consolidation
• Power electronics partnerships
• Different M&A
• Focus on China
334
• Conclusions 360
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POWER VS FREQUENCY ON ELECTRONICS
Power device technology positioning (2018)
Operating frequency (Hz)
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GLOBAL POWER ELECTRONICS MARKETS
2017-2023
Power device markets &
forecast 2016-2022
IGBT
MOSFET
Power IC
Silicon wafers
GaN & SiC devices
Inverter
Etc.
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COMPARISON OF MODULE MARKET SHARES
By device type, 2017 vs 2023
XX Modules will gain a XX% of the total module market by 2023
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DRIVING POWER ELECTRONICS
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Power electronics is driven by application penetration and it
is boosted by megatrends and subventions. Some applications
also need from new segments:
• EV/HEV needs the development of Charging stations or
LiDAR solutions for the autonomous car
• PV or Wind need the Stationary Energy Storage for
efficient systems
14
PACKAGING TYPE BY POWER INVERTER
Power modules, discretes or embedded ?
Inverter power
Functionality integration
More
Less
IPMSmall device, small power.All-in-one: IGBT, diodes, drivers and control.
Discrete packagingSmall device, medium power.All in one: MOSFET, IGBT, or co-pack IGBT and diode.
6-in-1 power moduleLarge device, medium power.
Six IGBTs and diodes.IGBT driver is external.
Single power moduleLarge device, large power.One IGBT and diode. Several chips to handle the current.IGBT driver is external.
MW range100s kW range10s kW rangeWatt to kW range
IPM: Intelligent Power Module
Embedded PackageSmall device.Small heat dissipationSemiconductor embedded in PCB.
Power IC
2-in-1 & 1-in-1 power modulesMedium power.2 or 1 IGBT packagedtogether with the diode.Trend in EV/HEV
New packaging trends
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GLOBAL POWER ELECTRONICS MARKETS
2017-2023
Power device markets & forecast 2016-2022
Discrete and
module
market
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SIC & GAN MARKETS
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OTHER SEMICONDUCTOR MATERIALS FOR POWER
Today and tomorrow
applications for SiC and
GaN devices, among
other compound
materials
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INCREASING BATTERY PACK ENERGY CAPACITY PER ELECTRIC VEHICLE
Driving range as a function of battery energy capacity
• Driving range (mileage) increases as battery size grows and efficiency improves.
• There is a clear trend towards larger battery energy capacity, driven by decreasing battery price and increasing customer demands for longer driving range.
Driving range (NEDC) as a function of battery energy capacity
Nissan LEAF
Renault Twizy
Toyota RAV4EV
Tesla Model S
BYD E6Car-sharing
and small
city cars
Big and
luxury BEV
NEDC: New European Driving CycleMore power needed to charge
larger capacity batteries
more Amps
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HIGHER INTEGRATION NEW CHALLENGES
Integration also means closer to the semiconductors hotspots
• When we talk about higher integration at converter level, it also means higher power density at power semiconductorand converter level. In consequence, higher power values flow through a smaller area/volume, increasing the temperature.
• This means that the components that are closer to the heat-source of the power module needs to support highertemperatures as well.
• Laminated busbars, cooling systems, gate driver boards and DC-link capacitors are the components that are close to the power module.
• Among all those parts, the film capacitors are still today the main barrier to get to high temperatures.
Higher integrationHigher power
density
Higher
temperature
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TECHNOLOGY
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HOW TO ASSEMBLE: DIRECT INVERTER OR WITH POWER STACK?
For power higher than 100kW, two approaches exist: direct inverter assemblies and assemblies using power stacks.
1kW
100kW
0
Power
10kW
1MW
2kW
20kW
200kW
Power
Stack
Assembly
Inverter
Normally, a power stack is not used for power lower than 100 kW
Direct Inverter Assembly
InverterDirect Inverter Assembly
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HARSH ENVIRONMENT – CAN BE ALSO FOUND ELSEWHERE
Harsh environment conditions can be found also in more conventional applications
Thermal cycling Vibrations Radiation
Aggressive chemical
environment
Humid
environment
Dust G factor
Car gas exhaust
in HEVEV/HEV in the
winter storm
Car brake disc High mountain electric train
PV inverters in a pig farm with PV
panels on the roofApplications in regions with
high humidity
Electric motors covered by flour
dust Rapidly accelerating (braking)
electric car
Ammonia
Extremely low/high
temperature
Car gas exhaust
in HEV
Car brake disc Power electronics for in-wheel motor
Image:
Protean
Electric
Harsh environment in conventional applications
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MARKET SHARES
Power semiconductor
ranking
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M&A AND FINANCIAL ANALYSIS
Company profiles
M&A
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RELATED REPORTS
Status of the Power Electronics Industry 2018 | Sample | www.yole.fr | ©2018
Last year we saw an impressive 8.4% year-to-year growth rate for power electronics in the main power inverter segments, including electric and hybrid electric vehicles (EV/HEV), motor drives and uninterruptible power supplies (UPS). To understand this market it is important to recognize that power electronics is application driven, not technology driven, unlike other ‘More than Moore’ electronics areas. In recent years this market has grown thanks to megatrends such as the arrival of the digital era or environmental issues. We can directly link the latter to governmental funds given by different countries for energy efficiency improvement, increasing sales of new power electronics systems.
As an example, the EV/HEV segment is driven technologically by CO2 emission reduction targets, higher efficiency requirements or less dependency on the oil industry. Today, full electric cars represent slightly over 5% of EV/HEV sales volumes, while they will represent 21% by 2023. Overall, Yole Développement's (Yole) analysts expect the EV/HEV power electronics segment to grow with an impressive 20.7% compound annual growth rate for 2017-2023 (CAGR
2017-2023).
Subsidies have an enormous impact on the renewable energy market. This can be seen in the PV market shrinkage predicted in 2018 due to the strong reduction of subsidies in China, which had about the 50% of the solar global installations in 2017. Nevertheless, Yole expects that the market will recover in the mid-term thanks to the decrease in cost and the increase of installations in other regions of the world.
On the other hand, there are some new power electronics segments that need to be developed for the proper expansion of other existing power markets. This is the case of the DC charging or the stationary energy storage markets. In fact, DC charging solutions need to be rapidly developed to follow the growth of the EV/HEV market with fast and efficient charging. Likewise, for further development of the PV and wind market, stationary energy storage systems need to be expanded.
In this report, Yole summarizes the different trends on power electronics driving applications, with the main technology developments associated with each application.
STATUS OF THE POWER ELECTRONICS INDUSTRY 2018Market & Technology report - August 2018
POWER ELECTRONICS: AN APPLICATION DRIVEN MARKET
EV/HEV, motor drives, computing and storage propel power electronics market growth, from devices to passives, packaging and integration.
KEY FEATURES• The power electronics
semiconductor market reached $32.7B in 2017 and we expect the growth to continue in 2018
• The IGBT market grew 11.7% from 2016 to 2017. In 2018, IGBTs are expecting similarly spectacular growth, higher than 10%
• EV/HEV growth is confirmed, making this the dominant segment for technology innovation
• Solutions for thermal management and harsh environments are attracting increasing interest
• The entrance of SiC and GaN devices will grab market share from silicon
• The PV market will drop from 2018 due to cut of subsidies in China but is expected to progressively recover
• Yole Développement's analysts expect the power module market to take share from discrete devices
WHAT’S NEW• Update on power electronics wafer
level market from 2017 to 2023• Update on power electronics
major discrete and module segments including IGBT, MOSFET and Power IC from 2017 to 2023
• Update of power electronics inverter market from 2017 to 2023
• Market and technology trends for each power electronics application
• Focus on EV/HEV market and on technology and packaging trends
• Passive components, batteries, power stack technological trends
• Harsh environments and thermal management in power electronics
• Wide band gap section update, with GaN and SiC market
• Other compound semiconductors for power electronics
• Company profile updates with 2017 revenues and key features
• Power electronics player ranking and landscape analysis for 2017
• Analysis of the latest M&A activity
(Yole Développement, August 2018)
Climate change
Governmental subventions
Artificial Intelligence
Adjacent application needs
Digital era
2017
2010
From niche to new applications
PV
Motor drive
Rail
EV/HEV
UPS
Wind
Power Supply
Server andData Center
LiDAR
ChargingStation
WirlessPower
PV
Wind
Motor drive
UPS
Rail
EV/HEV
Power Supply Server andData Center
What is driving the power electronics industry?
POWER ELECTRONIC SEMICONDUCTOR DEVICES GREW 11.7% FROM 2016 TO 2017
The total power electronics market was worth $32.7B in 2017, with power ICs representing about the half of that. Last year saw a boom in the power electronics semiconductor market with an impressive 11.7% year-to-year growth rate, mainly
due to the increase in sales in IGBT devices for EV/HEVs and motor drives. Demand for computing and storage and for automotive segments also boosted the MOSFET device market by 8.3% in 2017.
STATUS OF THE POWER ELECTRONICS INDUSTRY 2018
Yole expects a very positive perspective over the next five years, with a CAGR2017-2023 of over 4% for the power device market. This will be driven mainly by EV/HEVs, which will account for almost $1.8B worth of MOSFETs and more than $1.9B in the IGBT market, including both discretes and modules. MOSFET demand will also be driven by networking and telecommunications, which is booming with an 8.3% CAGR2017-2023 due to the installation of 5G network infrastructure.
Many manufacturers are therefore enlarging their production capacities to fulfil these needs with short shipment times. For instance, Infineon is expanding its production capacity with 300mm fabs for power electronics devices, including IGBTs. As many applications in China are driven by its big domestic demand, it is also putting a lot of effort and funding into developing internal power electronics device technology and manufacturing know-how to expand downstream within the supply chain.
2017-2023 power electronics driving application evolution for discrete and module IGBTs & MOSFETs markets
(Yole Développement, August 2018)
$10.4 B$13.2 B
20232017
$1.35 B
$2.3 B
Computing & Storage
$1.51 B
$2.5 B$3.7 B
Industrial
$0.7 B
$1.4 B
Consumer [1]
$1.52 B
Homeappliance
$0.8 B
[1] Consumer segment includes Portable & Wireless and Audio & Image applications
$2.68 B $3.16 B
OthersEV/HEV
$2 B
CAGR2017-2013:
+4%
TECHNOLOGY STILL MATTERS
The power electronics market needs to evolve with regards to efficiency and thermal management due to the large power loads systems are handling. The main players need to invest in technology development to reduce device and system costs, to reduce weight and size without impairing thermal management or reliability. Optimized solutions are being implemented at device, packaging, module, power stack or inverter levels. Passive components have to be also adapted to fully use the potential of new semiconductor materials, devices and system designs.
Yole sees a strong improvement axis that relies on device development, either in silicon or in wide band gap materials like SiC or GaN. Therefore, end-users could achieve higher system efficiencies, going to
higher frequencies and higher power densities by using more compact systems or even integrating them in a single chip. However, even as SiC penetrates different applications, silicon solutions are still being developed and optimized for high efficiency systems. As an illustration, we saw the new generation of Infineon’s IGBT coming to the market last year.
In this report, Yole’s analysts summarize different technology improvements and trends for the full inverter components. That includes the challenger materials SiC and GaN, which must still battle to ramp up production. Yole's analysts show how technology advances are linked to application needs like the power module innovations required for EV/HEV.
Improvement trends* for different system components
(Yole Développement, August 2018)
Powermodules/IPM
DC link capacitors
Laminated busbars
Cooling systems
Current sensors
Switching drivers
Fuses, over voltage protections, etc.
• Wide Band Gap • High temperature packaging• Advanced packaging in power
(WLP, embedded)
• High operating temperature and high voltages
• Signal and power connections in one device • Integration of water pipes
• Direct liquid systems
• Coreless transformer isolation• Capacitive coupling isolation
*Non-exhaustive list
• Higher operating temperature• Improved accuracy • Small and compact designs
• Faster response time • Higher operating temperature
• New substrate materials• Bond-free interconnections• New encapsulation materials• High temperature packaging
Discrete devices
MARKET & TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)ABB, Alpha and Omega Semiconductor (AOS), Amkor, Analog Devices, ASE Group, AT&S, AVX, BMW Group, Bosch, BYD, Continental, Cree, CRRC, Danfoss, Delphi, Denso, Dialog Semiconductor, Diodes Incorporated, DuPont Teijin Films, Dynex, EXAGAN, Fuji Electric, GaN Systems, General Electric, GeneSiC, Global Wafers, Goldwind, Hitachi, Huawei, Infineon, Intel, Intersil, Littelfuse, Macmic, Microchip, Microsemi, Mitsubishi Electric, Navitas, Nissan, NXP, Okmetic, ON Semiconductor, Panasonic, Qualcomm, Renault, Renesas, Rohm, Sanken, Semikron, Shindengen, Siemens, Silego Technology, ST Microelectronics, StarPower, STATSChipPAC, Sungrow, TDK, Tesla Motors, Topsil, Toray, Toshiba, Toyota, Transphorm, TSMC, USCi, Vincotech, Vishay, Volkswagen, Wolfspeed, and more.
What is new vs what is updated? 4
Executive summary 11
Introduction 46
Power electronics market 61
Power electronics drivers and evolution 114
Driving applications 122
Focus on EV/HEV 138
Technology analysis 153
> Toward more integration in power electronics> Power stack> Passive components
- Power capacitors - Inductors- Bus bar
> Wide Band Gap devices- SiC- GaN-on-Si- Other WBG- Battery and Power electronics- Power electronics for harsh environment
Power electronics landscape 297
Mergers & Acquisitions 334
> Focus on China
Conclusions 360
TABLE OF CONTENTS (complete content on i-Micronews.com)
Find more details about
this report here:
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OBJECTIVES OF THE REPORT• Assess the market for wafers, devices, modules and inverters• Understand the market dynamics for the whole power electronics industry• Identify the key drivers that will shape the market in the future• To have an overview on the different components used in power electronics and its integration• Understand the main technological challenges to overcome and the solutions developed so far• Provide a clear overview of the different applications driving the power electronics business• Present data ranking the power electronics industry leaders, describing supply chain consolidation,
the latest M&A activity and future trends in the power player landscape
Dr. Ana Villamor is involved in many custom studies and repor ts focused on emerging power electronics technologies at Yole Développement, including device technology and reliability analysis (MOSFET, IGBT, HEMT, etc). In addition, Ana is leading the quarterly power management market updates released in 2017. Previously Ana worked within the CNM research center and for the leading power electronic company ON Semiconductor. During this partnership and after two years as Silicon Development Engineer, she acquired a relevant technical expertise and a deep knowledge of the power electronic industry. Ana is author and co-author of several papers as well as a patent. She holds an Electronics Engineering degree completed by a Master in micro and nano electronics, both from Universitat Autonoma de Barcelona (SP).
Dr. Milan Rosina has 20 years of scientific, industrial and managerial experience involving equipment and process development, due diligence, technology, and market surveys in the fields of renewable energies, EV/HEV, energy storage, batteries, power electronics, thermal management, and innovative materials and devices. He received his Ph.D. degree from National Polytechnical Institute (Grenoble, France). He previously worked for the Institute of Electrical Engineering in Slovakia, Centrotherm in Germany, Fraunhofer IWS in Germany, CEA LETI in France, and utility company ENGIE in France.
Alejandra Fuentes Suarez researches the latest developments in power conver ter topologies , passive components, power modules packaging and EV/HEV every day. Previously she acquired extensive expertise in the design of power converters for solar, wind, hydro and motor drive applications at Semikron (FR). Alejandra graduated from UJF (Grenoble, FR) and INP (Grenoble, FR) as an electrical engineer, specializing in design of power electronics systems. She also holds an advanced master’s in the field of marketing and management of energy from the Grenoble Business School (Grenoble, FR).
As analysts within the Power & Wireless division at Yole Développement Dr. Ana Villamor, Dr. Milan Rosina and Alejandra Fuentes Suarez co-authored the Status of the Power Electronics Industry 2018 report:
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+82 2 713 9674 – [email protected]• Specific inquiries: +33 472 830 180 – [email protected]
(1) Our Terms and Conditions of Sale are available at www.yole.fr/Terms_and_Conditions_of_Sale.aspx The present document is valid 24 months after its publishing date: August 22, 2018
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ABOUT YOLE DEVELOPPEMENT
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, Software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business.
CONSULTING AND ANALYSIS• Market data & research, marketing analysis• Technology analysis• Strategy consulting• Reverse engineering & costing• Patent analysis• Design and characterization of innovative optical systems• Financial services (due diligence, M&A with our partner)More information on www.yole.fr
MEDIA & EVENTS• i-Micronews.com website & related @Micronews e-newsletter• Communication & webcast services• Events: TechDays, forums…More information on www.i-Micronews.com
REPORTS• Market & technology reports• Patent investigation and patent infringement risk analysis• Teardowns & reverse costing analysis• Cost simulation toolMore information on www.i-micronews.com/reports
CONTACTSFor more information about :• Consulting & Financial Services: Jean-Christophe Eloy ([email protected])• Reports: David Jourdan ([email protected]) Yole Group of Companies• Press Relations & Corporate Communication: Sandrine Leroy ([email protected])
© 2018
Yole Développement
FromTechnologies to Market
Source: Wikimedia Commons
2©2018 | www.yole.fr | About Yole Développement
YOLE DEVELOPPEMENT – 4 DIVISIONS
Life Sciences
& Healthcare o Microfluidic
o BioMEMS
o Inkjet Printing
o Solid-State Medical Imaging & BioPhotonics
o Bio Technologies
Power
& Wireless
o RF Devices & Technology
o Compound Semiconductors & Emerging Materials
o Power Electronics
o Batteries & Energy Management
Semiconductor
& Software o Package & Assembly & Substrates
o Semiconductor Manufacturing
o Memory
o Software & Computing
Photonics,
Sensing & Display
o Solid-State Lighting & Display
o MEMS, Sensors & Actuators
o Imaging
o Photonics & Optoelectronics
Semiconductor
& Software
Power & Wireless
Photonics,
Sensing
& Display
Life
Sciences &
Healthcare
3©2018 | www.yole.fr | About Yole Développement
3 BUSINESS MODELS
o Consulting and Analysis
• Market data & research,
marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering & costing
• Patent analysis
• Design and characterization of
innovative optical systems
• Financial services (due diligence,
M&A with our partner)
www.yole.fr
o Syndicated reports
• Market & technology reports
• Patent investigation and patent
infringement risk analysis
• Teardowns & reverse costing
analysis
• Cost simulation tool
www.i-Micronews.com/reports
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication & webcast
services
• Events: TechDays, forums,…
www.i-Micronews.com
4©2018 | www.yole.fr | About Yole Développement
6 COMPANIES TO SERVE YOUR BUSINESS
Due diligence
www.yole.fr
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
Market, technology and strategy
consulting
www.yole.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Design and characterization of
innovative optical systems
www.piseo.fr
Yole Group of Companies
5©2018 | www.yole.fr | About Yole Développement
OUR GLOBAL ACTIVITY
30%of our business
40%of our business 30%
of our business
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Yole Inc.
Phoenix
Yole Korea
Seoul
Palo Alto
6©2018 | www.yole.fr | About Yole Développement
ANALYSIS SERVICES - CONTENT COMPARISON
Technology
and Market
Report
Leadership
Meeting
Q&A
Service
Depth of the analysis
Bre
adth
of th
e a
nal
ysis
Meet the
Analyst
Custom
Analysis
High
High
Low
7©2018 | www.yole.fr | About Yole Développement
SERVING THE ENTIRE SUPPLY CHAIN
Our analysts provide market analysis,
technology evaluation,
and business plans along the entire
supply chain
Integrators, end-
users and software
developpers
Device manufacturers
Suppliers: material, equipment,
OSAT, foundries…
Financial investors, R&D centers
8©2018 | www.yole.fr | About Yole Développement
SERVING MULTIPLE INDUSTRIAL FIELDS
We workacross
multiples industries to understand
the impact of More-than-
Moore technologies from deviceto system
From A to Z…
Transportation
makers
Mobile phone
and
consumer
electronics
Automotive
Medical
systems
Industrial
and defense
Energy
management
9©2018 | www.yole.fr | About Yole Développement
o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a
collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market & technology analysis, patent
investigation and patent infringement risk analysis, teardowns & reverse costing analysis.They cover:
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain…
Our reports are for you!
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industrylandscape.
In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of theindustry.
o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Bundled Offer and receive at least a 36% discount.
REPORTS COLLECTION
www.i-Micronews.com
• MEMS & Sensors
• RF devices & technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
• Software
• Memory
10©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (1/4)
MEMS & SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 – Update
− Silicon Photonics 2018 – Update
− Consumer Biometrics: Hardware & Software 2018 – Update
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Acoustic MEMS and Audio Solutions 2017
− MEMS & Sensors for Automotive Market & Technology Trends 2017
− High End Inertial Sensors 2017
− Magnetic Sensor 2017
o REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
– by System Plus Consulting
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product
Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− MEMS Pressure Sensor 2018 – Market & Technology Report
− MEMS Pressure Sensor Comparison 2018 – Structure, Process & Cost Report
− Gas & Particles 2018 – Market & Technology Report
− Gas & Particles Comparison 2018 – Structure, Process & Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market &
Technology Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
− MEMS Packaging 2017 – Market & Technology Report
− MEMS Packaging Comparison 2017 – Structure, Process & Cost Report
RF DEVICES AND TECHNOLOGIES
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Wireless technologies (Radar, V2X) for Automotive 2018
− RF Standards and Technologies for Connected Objects 2018
− RF & Photonic Components & Technologies for 5G Infrastructure 2018
o REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT– by System
Plus Consulting
− Automotive Radar Comparison 2018
o PATENT ANALYSES – by KnowMade
− RF Acoustic Wave Filters 2017 – Patent Landscape Analysis
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market
& Technology Report – Update
− RF Front-End Module Comparison 2018 – Structure, Process & Cost Report
− RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis
− Advanced RF System-in-Package for Cellphones 2018 – Market & Technology
Report – Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
& Cost Report
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
Market & Technology Report – Update
− RF GaN Comparison 2018* – Structure, Process & Cost Report
− RF GaN 2018 – Patent Landscape Analysis
SOFTWARE
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Consumer Biometrics: Sensors & Software 2018 – Update
− Processing Hardware and Software for AI 2018 - Vol. 1 & 2
− From Image Processing to Deep Learning, Introduction to Hardware and Software
Update : 2017 version still available / *To be confirmed
11©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (2/4)
IMAGING & OPTOELECTRONICS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the Compact Camera Module and Wafer Level Optics
− Industry 2018 – Update
− 3D Imaging and Sensing 2018 – Update
− Sensors for Robotic Vehicles 2018
− Machine Vision for Industry and Automation 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− Uncooled Infrared Imagers 2017
o PATENT ANALYSES – by KnowMade
− iPhone X Dot Projector – Patent-to-Product Mapping
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− Status of the CMOS Image Sensor Industry 2018 – Market & Technology Report -
Update
− CMOS Image Sensor Comparison 2018 – Structure, Process & Cost Report
− CMOS Image Sensors Monitor 2018* – Quaterly Update**
− Camera Module 2017 – Market & Technology Report
− Compact Camera Module Comparison 2018 – Structure, Process & Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market & Technology
Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
ADVANCED PACKAGING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Advanced Packaging Industry 2018 – Update
− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrate Like PCB Trends
− 3D TSV and Monolithic Business Update 2018 – Update
− Power Modules Packaging 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Status of Panel Level Packaging 2018
− Trends in Automotive Packaging 2018
− Hardware and Software for AI 2018 - Vol. 1 & 2
− Thin-Film Integrated Passive Devices 2018
− Memory Packaging Market and Technology Report 2018 – Update*
o PATENT ANALYSES – by KnowMade
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
o LINKED REPORTS– by Yole Développement and System Plus Consulting
− Advanced RF System-in-Package for Cellphones 2018 – Market & Technology Report -
Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
& Cost Report
− Fan-Out Packaging 2018 – Market & Technology Report – Update*
− Fan-Out Packaging Comparison 2018* – Structure, Process & Cost Report
MANUFACTURING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Wafer Starts for More Than Moore Applications 2018
− Equipment for More than Moore: Technology & Market Trends
for Lithography & Bonding/Debonding 2018
− Polymeric Materials for wafer-level Advanced Packaging 2018
− Laser Technologies for Semiconductor Manufacturing 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Equipment and Materials for 3D TSV Applications 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− Equipment for More than Moore: Technology & Market Trends for
Lithography & Bonding/Debonding 2018 – Market & Technology Report
− Wafer Bonding Comparison 2018 – Structure, Process & Cost Report
Update : 2017 version still available / *To be confirmed
12©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (3/4)MEMORY
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update*
o QUARTERLY UPDATE – by Yole Développement**
− Memory Market Monitor 2018 (NAND & DRAM)
o MONTHLY UPDATE – by Yole Développement**
− Memory Pricing Monitor 2018 (NAND & DRAM)
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− DRAM Technology & Cost Review 2018
− NAND Memory Technology & Cost Review 2018
o PATENT ANALYSES – by KnowMade
− 3D Non-Volatile Memories – Patent Landscape
COMPOUND SEMICONDUCTORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Compound Semiconductor Industry 2018*
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Bulk GaN Substrate Market 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− Power SiC 2018: Materials, Devices, and Applications – Market & Technology
Report – Update
− SiC Transistor Comparison 2018 – Structure, Process & Cost Report
− Power SiC 2018 – Patent Landscape Analysis
− Power GaN 2018: Materials, Devices, and Applications – Market & Technology Report
– Update
− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process & Cost Report
− Status of the GaN IP – Patent Watch 2018 & Patent Activity 2017
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
– Market & Technology Report – Update
− RF GaN – Patent Landscape Analysis
POWER ELECTRONICS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Power Electronics Industry 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Power Electronics for Electric Vehicles 2018 – Update
− Integrated Passive Devices (IPD) 2018
− Wireless Charging Market Expectations and Technology Trends 2018
− Thermal Management Technology and Market Perspectives in Power
− Electronics and LEDs 2017
− Gate Driver 2017
− Power MOSFET 2017
− IGBT 2017
− Market Opportunities for Thermal Management Components in Smartphones 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting
and KnowMade
− Power Modules Packaging 2018 – Market & Technology Report – Update
− Automotive Power Module Packaging Comparison 2018 – Structure, Process & Cost Report
− Power ICs Market Monitor 2018 – Quaterly Update**
− Power ICs Market Comparison 2018* – Structure, Process & Cost Report
BATTERY AND ENERGY MANAGEMENT
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 –Update
o PATENT ANALYSES – by KnowMade
− Status of the Battery Patents – Patent Watch 2018 & Patent Activity 2017
o LINKED REPORTS – by Yole Développement and KnowMade
− Solid State Electrolyte Battery 2018 – Market & Technology Report
− Solid-State Batteries 2018 – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer
13©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (4/4)
SOLID STATE LIGHTING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update
− Automotive Lighting 2018: Technology, Industry and Market Trends – Update
− UV LEDs 2018: Technology, Industry and Market Trends – Update
− LiFi: Technology, Industry and Market Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− CSP LED Lighting Modules
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− Horticultural Lighting 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− VCSELs 2018: Technology, Industry and Market Trends – Market & Technology
Report
− VCSELs Comparison 2018 – Structure, Process & Cost Report
DISPLAYS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update
− Displays and Optical Vision Systems for VR/AR/MR 2018
− MicroLED Displays 2018 – Market & Technology Report – Update
o PATENT ANALYSES – by KnowMade
− MicroLED Display – Patent Landscape Analysis
MEDTECH
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− BioMEMS & Non Invasive Emerging Biosensors: Microsystems for Medical
− Applications 2018 – Update
− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update
− Neurotechnologies and Brain Computer Interface 2018
− CRISPR-Cas9 Technology: From Lab to Industries 2018
− Ultrasound Technologies for Medical, Industrial and Consumer Applications 2018
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Liquid Biopsy: from Isolation to Downstream Applications 2018
− Chinese Microfluidics Industry 2018
− Scientific Cameras for the Life Sciences & Analytical Instrumentation
Laboratory Markets 2018*
− Artificial Organ Technology and Market 2017
− Connected Medical Devices Market and Business Models 2017
− Status of the Microfluidics Industry 2017
− Organs-On-Chips 2017
− Solid-State Medical Imaging 2017
− Medical Robotics Market & Technology Analysis 2017
o PATENT ANALYSES – by KnowMade
− Microfluidic IC Cooling – Patent Landscape
− Circulating Tumor Cell Isolation – Patent Landscape
− OCT Medical Imaging – Patent Landscape
− Pumps for Microfluidic Devices – Patent Landscape 2017
− Microfluidic Technologies for Diagnostic Applications – Patent Landscape 2017
− FLUIDIGM – Patent Portfolio Analysis 2017
− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− Organs-On-Chips 2017 – Market & Technology Report
− Organ-on-a-Chip – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed
14©2018 | www.yole.fr | About Yole Développement
OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent Landscape Analysis
− RF Acoustic Wave Filters Patent Landscape Analysis
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N Patent Watch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− Microfluidic Technologies for Diagnostic Applications Patent Landscape
TEARDOWN & REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).