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FEATURESThe MOC810X and CNY17F-X devices consist of a gallium arsenide LED optically coupled

to a silicon phototransistor in a dual-in-line package.

Closely Matched Current Transfer Ratio (CTR) Minimizes Unit-to-Unit Variation Narrow (CTR) Windows that Translate to a Narrow and Predictable Open

Loop Gain Window Very Low Coupled Capacitance along with No Chip to Pin 6 Base

Connection for Minimum Noise Susceptibility To order devices that are tested and marked per VDE 0884 requirements,

the suffix .300 must be included at the end of part number. e.g. MOC8101.300

VDE 0884 is a test option.

APPLICATIONS Switchmode Power Supplies (Feedback Control)

AC Line/Digital Logic Isolation

Interfacing and coupling systems of different potentials and impedances

6-PIN DIP OPTOCOUPLERS FOR

POWER SUPPLY APPLICATIONS

(NO BASE CONNECTION)

6

1

6

1

6

1

MOC8101 MOC8102 MOC8103 MOC8104

MOC8105 MOC8106 MOC8107 MOC8108

CNY17F-1 CNY17F-2 CNY17F-3 CNY17F-4

2

1

3 NC

5

6NC

PIN 1. ANODE2. CATHODE3. NO CONNECTION4. EMITTER5. COLLECTOR6. NO CONNECTION

4

NOTE

1. Input-Output Isolation Voltage,VISO, is an internal device dielectric breakdown rating.

Parameter Symbol Value Unit

INPUT LED

Forward Current - Continuous IF 100 mA

Forward Current - Peak (PW = 1s, 300pps) IF(pk) 1 A

Reverse Voltage VR 6 Volts

LED Power Dissipation @ TA = 25C PD 140 mWDerate above 25C 1.33 mW/ C

OUTPUT TRANSISTOR

Collector-Emitter VoltageVCEO Volts

MOC8106/7/8, CNY17F-1/2/3/4 70

MOC8101/2/3/4/5 30

Emitter-Collector Voltage VECO 7 Volts

Detector Power Dissipation @ TA = 25C PD 200 mW

Derate above 25C 2.67 mW/ C

TOTAL DEVICE

Input-Output Isolation Voltage(1) VISO 5300 Vac(rms)

(f = 60 Hz, t = 1 min.)Total Device Power Dissipation @ TA = 25C PD 260 mW

Derate above 25C 2.94 mW/ C

Ambient Operating Temperature Range TOPR -55 to +100 C

Storage Temperature Range TSTG -55 to +150 C

Lead Soldering TemperatureTSOL 260 C

(1/16 from case, 10 sec. duration)

ABSOLUTE MAXIMUM RATINGS (TA =25C Unless otherwise specified)

2001 Fairchild Semiconductor CorporationDS300266 9/18/01 1 OF 10 www.fairchildsemi.com

SCHEMATIC

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Characteristic Symbol Min Typ** Max Unit

INPUT LED

Forward Voltage (IF = 60 mA) VF 1.0 1.4 1.65 V

Reverse Leakage Current (VR = 5.0 V) IR 0.001 10 A

Capacitance C 18 pF

OUTPUT TRANSISTOR

Collector-Emitter Dark Current (VCE = 10 V, TA = 25C) ICEO1 1.0 50 nA

(VCE = 10 V, TA = 100C) ICEO2 1.0 A

Collector-Emitter Breakdown Voltage

MOC8101/2/3/4/5 (IC = 1.0 mA) V(BR) CEO 30 100 V

MOC8106/7/8, CNY17F-1/2/3/4 (IC = 1.0 mA) 70 100

Emitter-Collector Breakdown Voltage (IE = 100 A) V(BR) ECO 7.0 10 V

Collector-Emitter Capacitance (f = 1.0 MHz, VCE = 0) CCE 8 pF

COUPLED

MOC8101 50 80

MOC8102 73 117

Output Collector CurrentMOC8103 108 173

(IF = 10 mA, VCE = 10 V)MOC8104 160 256

MOC8105 65 133

MOC8106 (CTR)(2) 50 150 %

MOC8107 100 300

MOC8108 250 600

CNY17F-1 40 80

(IF = 10 mA, VCE = 5 V)CNY17F-2 63 125

CNY17F-3 100 200

CNY17F-4 160 320

Collector-Emitter Saturation Voltage

CNY17F-1/2/3/4 (IC = 2.5 mA, IF = 10 mA) VCE(sat) 0.4 V

MOC8101/2/3/4/5/6/7/8 (IC = 500 A, IF = 5.0 mA)

Isolation Voltage (f = 60 Hz, t = 1.0 min.)(4) VISO

5300 Vac(rms)

Isolation Resistance (VI-O = 500 V)(4) RISO 10

11

Isolation Capacitance (VI-O = 0, f = 1.0 MHz)(4) CISO 0.5 pF

ELECTRICAL CHARACTERISTICS (TA =25C Unless otherwise specified)(1)

** All typicals at TA = 25C




MOC8101 MOC8102 MOC8103 MOC8104

MOC8105 MOC8106 MOC8107 MOC8108


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** All typicals at TA = 25C

NOTES:1. Always design to the specified minimum/maximum electrical limits (where applicable).2. Current Transfer Ratio (CTR) = IC/IF x 100%.

3. For test circuit setup and waveforms, refer to Figure 7.4, For this test, Pins 1 and 2 are common, and Pins 4 are 5 are common.

AC Characteristic Test Conditions Symbol Min Typ** Max Unit

NON-SATURATED SWITCHING TIMEton 2 10Turn-on Time CNY17F-1/2/3/4 Only (RL = 100 , IC = 2 mA) s

Turn-off Time CNY17F-1/2/3/4 Only (VCC = 10 V) toff 3 10

Turn-On Timeton 2 All Devices (IC = 2.0 mA, VCC = 10 V, RL = 100 )

(3)

sTurn-Off Time

toff 3 All Devices (IC = 2.0 mA, VCC = 10 V, RL = 100 )(3)

Rise Timetr 1 All Devices (IC = 2.0 mA, VCC = 10 V, RL = 100 )

(3)

sFall Time

tf 2 All Devices (IC = 2.0 mA, VCC = 10 V, RL = 100 )(3)

SATURATED SWITCHING TIMES

Turn-on Time (IF = 20 mA, VCE = 0.4 V) 5.5

CNY17F-1ton sCNY17F-2

CNY17F-3 (IF = 10 mA, VCE = 0.4 V) 8.0

CNY17F-4

Rise Time(IF = 20 mA, VCE = 0.4 V) 4.0CNY17F-1

CNY17F-2 tr s

CNY17F-3 (IF = 10 mA, VCE = 0.4 V) 6.0

CNY17F-4

Turn-off Time(IF = 20 mA, VCE = 0.4 V) 34CNY17F-1

CNY17F-2 toff s

CNY17F-3 (IF = 10 mA, VCE = 0.4 V) 39

CNY17F-4

Fall Time(IF = 20 mA, VCE = 0.4 V) 20CNY17F-1

CNY17F-2 tf s

CNY17F-3 (IF = 10 mA, VCE = 0.4 V) 24CNY17F-4

TRANSFER CHARACTERISTICS (TA =25C Unless otherwise specified)




MOC8101 MOC8102 MOC8103 MOC8104

MOC8105 MOC8106 MOC8107 MOC8108


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NORMALIZ

ED

CTR

NORMALIZED

CTR

Fig. 3 Normalized CTR vs. Ambient Temperature Fig. 4 CTR vs. RBE (Saturated)

TA - AMBIENT TEMPERATURE (C) RBE - BASE RESISTANCE (k)

o-75 -50 -25 0 25 50 75 100 125

NORMALIZED

CTR

0.4

0.6

0.8

1.0

1.2

1.4

1.6

IF = 20 mA

IF = 10 mA

IF = 5 mA

Normalized toIF = 10 mATA = 25C

10 100 1000

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

IF = 5 mA

IF = 10 mA

IF = 20 mA

TA = 25CVCE = 0.3 VNormalized to CTR @ RBE = Open

IF - LED FORWARD CURRENT (mA)

1 10 100

VF-FORWAR

DVOLTAGE(V)

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

TA = 55C

TA = 100C

TA = 25C

Fig. 2 Normalized CTR vs. Forward CurrentFig. 1 LED Forward Voltage vs. Forward Current

IF - FORWARD CURRENT (mA)

0 5 10 15 20

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

Normalized toIF = 10 mA

TA = 25CVCE = 5.0 V




MOC8101 MOC8102 MOC8103 MOC8104

MOC8105 MOC8106 MOC8107 MOC8108



TYPICAL PERFORMANCE CURVES

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MOC8101 MOC8102 MOC8103 MOC8104

MOC8105 MOC8106 MOC8107 MOC8108



Fig. 8 Normalized toff vs. RBE

10 100 1000 10000

NORMALIZED

toff

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4VCC = 10 V

IC = 2 mARL = 100

Normalized to toff@ RBE = Open

RBE - BASE RESISTANCE (k)

NORMALIZEDton

Fig. 7 Normalized ton vs. RBE


10 100 1000 10000

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

VCC = 10 V

IC = 2 mA

RL = 100

Normalized to ton@ RBE = Open

Fig. 6 Collector Emitter Saturation Voltagevs Collector Current

0.01 0.1 1 100.001

0.01

0.1

1

10

100

IF = 5 mA

IF = 2.5 mA

IF = 10 mA

IF = 20 mA

TA = 25C

VCE(sat)-COLLECTOR-EMITTER

SATURATIONVOLTAGE(V)

IC - COLLECTOR CURRENT (mA)

Fig. 5 CTR vs. RBE (Unsaturated)

NORMALIZ

EDCTR


10 100 1000

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

IF = 20 mA

IF = 10 mA

IF = 5 mA

TA = 25CVCE = 5.0 V

Normalized to CTR @ RBE = Open

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MOC8101 MOC8102 MOC8103 MOC8104

MOC8105 MOC8106 MOC8107 MOC8108


Fig. 10 Dark current vs. Ambient Temperature.

0 25 50 75 100 125

ICEO-

COLLECTOR-EM

ITTER

DARKCURRENT(A)

1e-6

1e-5

1e-4

1e-3

1e-2

1e-1

1e+0

1e+1

VCE = 10V

TA - AMBIENT TEMPERATURE (C)

Fig. 9 Switching Speed vs. Load Resistor

R-LOAD RESISTOR (k)

0.1 1 10 100

SWITCHIN

GSPEED-(s)

0.1

1

10

100

1000

Toff

Tf

IF = 10 mA

VCC = 10 V

TA = 25C

Tr

Ton


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OUTPUT PULSE

INPUT PULSE

TEST CIRCUIT WAVE FORMS

tr tf

INPUT

IF RL = 100

VCC = 10V

OUTPUT

ton

10%

90%

toff

Figure 7. Switching Time Test Circuit and Waveforms

IC

Adjust IF to produce IC = 2 mA




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MOC8105 MOC8106 MOC8107 MOC8108



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Lead Coplanarity : 0.004 (0.10) MAX

0.270 (6.86)

0.240 (6.10)

0.350 (8.89)

0.330 (8.38)

0.300 (7.62)

TYP

0.405 (10.30)

MAX

0.315 (8.00)

MIN

0.016 (0.40) MIN

2

5

PIN 1

ID.

0.016 (0.41)

0.008 (0.20)

0.100 (2.54)

TYP

0.022 (0.56)

0.016 (0.41)

0.070 (1.78)

0.045 (1.14)

0.200 (5.08)

0.165 (4.18)

4

3

0.020 (0.51)

MIN

1

6

0.100 (2.54)

TYP

0.020 (0.51)

MIN

0.350 (8.89)

0.330 (8.38)

0.270 (6.86)

0.240 (6.10)

PIN 1

ID.

0.022 (0.56)

0.016 (0.41)

0.070 (1.78)

0.045 (1.14)

0.200 (5.08)

0.135 (3.43)

0.300 (7.62)

TYP0 to 15

0.154 (3.90)

0.100 (2.54)

SEATIN

GP

LANE

0.016 (0.40)

0.008 (0.20)

SEATINGP

LA

NE

0.016 (0.40)

0.008 (0.20)

0.070 (1.78)0.045 (1.14)

0.350 (8.89)0.330 (8.38)

0.154 (3.90)0.100 (2.54)

0.200 (5.08)0.135 (3.43)

0.004 (0.10)

MIN

0.270 (6.86)

0.240 (6.10)

0.400 (10.16)

TYP

0 to 150.022 (0.56)

0.016 (0.41)

0.100 (2.54) TYP

NOTE

All dimensions are in inches (millimeters)

0.070 (1.78)

0.060 (1.52)

0.030 (0.76)

0.100 (2.54)

0.295 (7.49)

0.415 (10.54)

Package Dimensions (Surface Mount)Package Dimensions (Through Hole)

Package Dimensions (0.4Lead Spacing) Recommended Pad Layout forSurface Mount Leadform




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S .S Surface Mount Lead Bend

SD .SD Surface Mount; Tape and reel

W .W 0.4 Lead Spacing

300 .300 VDE 0884

300W .300W VDE 0884, 0.4 Lead Spacing

3S .3S VDE 0884, Surface Mount

3SD .3SD VDE 0884, Surface Mount, Tape & Reel

Option Order Entry Identifier Description

4.0 0.1

1.55 0.05

User Direction of Feed

4.0 0.1

1.75 0.10

7.5 0.1

16.0 0.3

12.0 0.1

0.30 0.05

13.2 0.2

4.85 0.20

0.1 MAX 10.30 0.20

9.55 0.20

1.6 0.1

QT Carrier Tape Specifications (D Taping Orientation)

ORDERING INFORMATION

NOTE

All dimensions are in inches (millimeters)




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MOC8105 MOC8106 MOC8107 MOC8108



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MOC8101 MOC8102 MOC8103 MOC8104

MOC8105 MOC8106 MOC8107 MOC8108


DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TOANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME

ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBEDHEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF

OTHERS.

LIFE SUPPORT POLICY

FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD

SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or

systems which, (a) are intended for surgicalimplant into the body,or (b) support or sustain life,

and (c) whose failure to perform when properlyused in accordance with instructions for use provided

in labeling, can be reasonably expected to result in asignificant injury of the user.

2. A critical component in any component of a life supportdevice or system whose failure to perform can bereasonably expected to cause the failure of the life

support device or system, or to affect its safety oreffectiveness.


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