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2 0 0 9 0 4 + 0 5 v o l . 2 1 Contents

Cover Story

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Wafer level CSP (ultimate downsizing)

Wafer Packaging Dicing

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Bump Process PKG Process_

<STD Process>

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NEPES Pte Ltd recently received significant recognition for outstanding sup-

port and performance by one of our major customers - Broadcom

Corporation.

Two of our individual employees were singled out to receive individual spe-

cial awards. They are Michael Lim Hyo Jong (QM Manager) and Frederick

Lum Chee Sheng (Production Manager) for their outstanding dedication &

work in their respective areas, and specifically in the support on Wafer-

Level Packaging for Broadcom.

In his statement, Dr. Matt Kaufmann-Director of Broadcom's Global IC

Assembly & Package Development said that despite Broadcom's demanding

requirements, they are pleased to have Assembly partners whose engi-

neers have demonstrated the necessary dedication and ability to handle

the complex tasks and to turn new ideas into reality. This have earned the

confidence & trust of the Broadcom organization to continue to work with

NEPES Pte Ltd as a partner for delivering leading-edge technologies to cre-

ate some of the most advanced products in the world.

From our CEO, Mr. Cheng Hing Nan - "This is not only a recognition of out-

standing performances by Michael and Frederick, but also a demonstration

of the strong teamwork in winning the confidence of our customer, which

will translate into more business into the future".

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NEPESWAY

Step1

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p e r s o n n e l r a t i n g

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CHANGE

1W

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Superstar Challenger!

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