camera module specification - 广东光阵—专业生产鼠标扫 · pdf...

Global Optics Limited

二〇一三年八月二日 Colour 5 Mega CMOS Camera Module 1 VER 2.0

Camera Module Specification

Model: GEFF130602 UXGA(2592*1944 pixels)

Ver. 2.0

Customer Customer module

name Signature Date

1. All right are reserved; No one is permitted to reproduce, duplicate or explain

contents of this document, in any from, the

Whole or part of this document without Global Display permission

2. No license is granted by implication or otherwise under any patents or other rights

of any third party or Global Display Limited

Approved By Superior PM PL Approved



Contents 1. Introduction 3

2. Features 3

3. Block Diagram 4

4. Module Mechanical Dimensions 5

5. Pin Description 6,7

6. CMOS Sensor Specification 7

7. Optical Lens Specification 8

8. Absolute Maximum Ratings 8

9. Image Quality Specification 9

10. Reliability Test 10

11. Packaging 11.12

12. Handling Precautions 13



1. Introduction

The GEFF130602 Camera module is a compact camera module that captures video at the

resolution of 2592*1944 pixels. Its small form factor and low power consumption make it a

perfect image capturing solution for mobile or portable applications such as cellular phones,

digital still camera, video conference equipment, machine vision and security cameras.

The GEFF130602 Camera module is composed of the lens set, the plastic housing, the IR-cut

filter, camera-on-a-chip device integration both the 5Mega CMOS image sensor, the passive

components, and the substrate with a gold finger array that enables the module to be attached

to a customised flexible PCB.

2. Features



3. Block Diagram



4. Module Mechanical Dimensions



5. Pin Description Pin Location Name Pin Type Function/Description

1 DGND Power Digital Ground

2 MC-N I/O MIPI TX clock data lane negative output

3 MC-P I/O MIPI TX clock data lane positive output



6 MD1-P I/O MIPI TX Second data lane positive output

7 MD1-N I/O MIPI TX Second data lane negative output



10 MD0-P I/O MIPI TX First data lane positive output

11 MD0-N I/O MIPI TX First data lane negative output


13 XCLK Input Crystal clock input


15 RESETB Input RESET (active low with internal pull-down resistor)

16 NC NO CONNECT

17 NC NO CONNECT

18 NC NO CONNECT



21 NC NO CONNECT

22 AF_-VDD2.8V Power POWER Ground

23 DOVDD1.8V Power I/O Power supply

24 DVDD(1.8V/NC) Power Digital power supply

25 AVDD(2.8V) Power Analog Power supply

26 AGND Power Analog Ground

27 SIOC Input SCCB serial interface clock input




29 SIOD I/O SCCB serial interface data I/O


I2C Address

Write 0X78

Read 0X79

6. CMOS Sensor Specification

The heart of the 5Mega Camera module is a highly integrated chip solution composed of a

5Mega CMOS image sensor core and image processor. The chip is designed specifically to

address the demand of battery powered products such as cellular phones ,digital still camera,

video conference equipment, machine vision and security cameras etc. It incorporated

sophisticated camera functions on-chip and is programmable through a simple serial interface.



7. Optical Lens Specification

1. Focal Length 2.38mm

2. View Angle 91.23//87.73

3. Aperture (Fixed Iris) 2.4+/-5%

4. Lens Construction 4P

5. Mount Dimension 1/4

6. Optical Distortion <1.0%

7. Focusing Length 3M

8. Absolute Maximum Ratings

（1）



9．Image Quality Specification

No. Inspection Item Test Chart Condition Standard value

1 Resolution (53.3CM*40CM)

—3000MM

Center >=1300

Corner >=1000

2 Saturation 110%< Saturation<130%

3 Color Accary

mean( Δ E) mean( ΔC)

15 10

4 Color Uniformity

R/G B/G

0.9~1.1 0.9~1.1

5 AWB

D50 D65 A TL84

<0.15 <0.15 <0.15 <0.15

6 SNR >=35DB

7 Shading Corners worst Sides mean

>=65% >=65%

8 Distortion distortion<1%

9 Gray/Dynamic Gray > 15



10 Reliability Test

NO. Test Item Test Condition

1 Low Temperature Operating Test -20℃（±2℃）:100H

2 High Temperature Operating Test 65℃（±2℃）:100H

3 Constant Temperature /Humidity

Test 40℃（±2℃）、93%～95％RH:48H

4 Low Temperature Storage Test -30℃（±2℃）:100H

5 High Temperature Storage Test 65℃（±2℃）: 100H

6 Thermal Shock Test

(-30℃(±2℃) 1hrs→ -30℃(±2℃)~65℃(±2℃) <5min→

+65℃ (±2℃)1hrs→+65℃(±2℃)~-30℃(±2℃)

<5min)X20cycles

7 Vibration test 10~40~10 Hz frequency ;The amplitude of vibration :

2mm;Each direction (XYZ) duration for 10±0.5 minutes

8 Drop Test 1.5M / one corner, three side and six face Total:2cycles

(12times)

11 Electrostatic Discharge Test Contact is ±2KV.150PF/500ohm



11 Packaging ◆﹑The tray

–Size

．The tray size 230mm*180mm

–Material

．Bottom tray material: back antistatic PS

．Toy tray material: back antistatic PS

◆﹑Static bag :

–Size

．The static bag size 370mm x 250mm

–Material

．The first lay material : PE

．The second lay material : AL

．The third lay material : PET



◆﹑Carton Box

–Size ．The carton size 250mm x 200mm x 180mm

–Material

． The material : B Flute

◆﹑Put the paper sheet for carton’s top and bottom

–Size

．The carton size 370mm x 250mm

–Material

． The material : B Flute



12.Handling Precautions

DO NOT try to open the unit enclosure as there is no user-serviceable component inside.

To prevent damage to the camera module by electrostatic discharge, handling the

camera module ONLY after discharging ALL static electricity from yourself and ensuring

a static-free environment for the camera module.

DO NOT touch the top surface of the lens.

DO NOT press down on the lens.

DO NOT try to focus the lens.

DO NOT put the camera module in a dusty environment.

To reduce the risk of electrical shock and damage to the camera module, turn OFF the

power before connect and disconnect the camera module.

DO NOT drop the camera module more than 60 cm onto any hard surface.

To prevent fire or shock hazard, DO NOT expose camera module to rain or moisture.

DO NOT expose camera module to direct sunlight.

DO NOT put camera in a high temperature environment.

DO NOT use liquid or aerosol cleaners to clean the lens.

DO NOT make any charges or modifications to camera module.

DO NOT subject camera module to strong electromagnetic field.

DO NOT subject the camera module to excessive vibration or shock.

All the project requirement needs reference module radiation to design

camera module specification - 广东光阵—专业生产鼠标扫 · pdf...

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