source ：全球產研整理， 2001/11

純玻璃觸控技術比較

比較項目電容式(Capacitive)

音波式 (SAW)

紅外線式 (IR) 近場感應式 (NFI)

觸控介質手或其他帶導體之介質

限手或其他軟性介質

手 ( 可戴手套 )或其他介質

手 ( 可戴手套 ) 或其他介質

感應方式運用人體靜電感應電流變化

偵測聲波

訊號遮斷

電場感應

透光度 90% 以上 92% 以上 100% 90%

觸控準確度佳 ( 錯誤率<1%)

優

佳

佳

觸控次數 2 億次 5,000 萬次千萬次以上

千萬次

特性防污、防火、防靜電及灰塵、耐刮、反應速度快

防火、耐刮可靠性高、耐刮、防火性佳、但防水及防汙性較差

防火性佳、但易受其他介質干擾

應用領域

ATM 、 POI 、POS 、公共查詢機 (KIOSK) 、工業用設備

公共查詢機、自動售票機、 POI 、 POS 、醫療器材

ATM 、 OA 事務機、電子白板、醫療器材、工業用設備

醫療器材及其他工業、特殊用途設備

Source ：全球產研整理， 2001/11

Capacitive_ Surface process

Grounding

Input Current

Input Current

Input Current

Input Current

Capacitive Operation Principle

電阻式觸控面板構成及種類 Film/Film Film/Glass Glass/Glass Film/Plastic

上側 Film Film Glass Film

下側 Film Glass Glass Plastic

特性

1. 重量輕2. 應用二層 Film 的貼和，透光率至少(80% 以上 )

1. 目前最主流使用之產品，技術最成熟2. 透光率達 82% 以上

適合條件惡劣的環境使用，抗候性、抗衡性佳

1. 質量輕、不易破損2. 透光率可達 80%以上

應用產品 FA 用途 PDA 車用顯示器 PDA

(Film or Plastic)


Dot Spacer

四線式五線式六線式七線式八線式

上部電極

下部電極

特性

1. 為最一般之配線方式，不受專利權限制2.. 產品不耐刮、壽命較短3. 價格最低

1. 美商 ELO Touch System 及 3M Touch System 之專利技術2. 改良四線式不耐刮之缺點

1. 國內廠商宇宙光電之專利技術2. 除耐刮外，更增加防電磁波及噪音功能

1. 日商富士通之專利技術2. 耐刮、準確度較高

1.3M Touch System之專利2. 耐溼度及環境溫度變化，適合工業用途

電阻式觸控面板電極配線方式


X1 X2

Y2

Y1

X2

X1 X3

X4

Y1 Y2

Y3 Y4Y2

X1X2

Y1 Y1

Y2

X1X2

電阻式面板結構


( Hard Coat Layer)

手指或筆等介質

薄膜(ITO Membrane)

上部電極(Electrode X1)

點隔片(Dot Spacer)

下部電極(Electrode Y1)

玻璃基板或薄膜(Glass or Film Plate)

玻璃電極(Glass Electrode)

薄膜電極(Film Electrode)

硬殼層(

手指或筆等介質

薄膜(ITO Membrane)

上部電極(Electrode X1)

點隔片(Dot Spacer)

下部電極(Electrode Y1)

玻璃基板或薄膜(Glass or Film Plate)

玻璃電極(Glass Electrode)

薄膜電極(Film Electrode)

電磁感應式 Digitizer_ structure

Sensor Board

LCD Display

Cover and Protective Glass

Battery Free, Digital Pen

Optical_ Infrared

http://www.elotouch.com/products/Touchscreens/CarrollTouch/howitworks.asp*Ref.[5]

http://www.elotouch.com/products/Touchscreens/CarrollTouch/howitworks.asp

AUO Proprietary & Confidential

Integrated Touch Panel

Optical_ Photo sensor

Black Matrix

Readout TFTPhoto-Sensor TFT

Color Filter

Pixel ITO

Black Matrix

Readout TFTPhoto-Sensor TFT

Color Filter

Pixel ITO

Cst2

Photo TFT W/L=6/6

Readout TFT

Sense lineData line

Blue pixel

Select line

*Ref.[6]

Operating of Press_Type Touch Panel△Clc2 will depend on the pressure.

PressRelease

Clc

Clc2 changedto Short

Clc

Cst on Com

Clc

Clc2

Readout TFT

Cfb

Charge Amplifier

Address TFT

Select

VREF

VOUT

reset

VCOM

CF VCOM (DC is better)

＋－

Provide by RSEF0 JM Display Area

Sensor Area

Touch Panel Touch Panel: PS on CF

Similar Hybrid PS structure

No need to add bump, but CF ITO is deposited on PS.

The space between PS and PX should be larger than 5m in case of alignment shift.

Photo Spacer

CF 1.4m

ITO (0.075m)

Cell Gap (normal area) 4.8m

Cell Gap (Sensing Area) 0.6m

Photo Spacer (4.0m)

Photo Spacer

Space > 5m

Pixel electrode

Pixel electrode

Touch Panel for New User InterfaceUI focusing on finger input (UI defines how user operates the device; not touch panel)

Apple iPhone LG PRADA HTC Touch

Screen Size 3.5” (HVGA 480x320) 3.0” (WQVGA 400x240) 2.8” (QVGA 320x240)

Touch Panel Capacitive Touch Panel Capacitive Touch Panel on Protective Screen (Synaptics)

Resistive Touch Panel

Multi-touch Multi-touch Single-touch Single-touch

Operation Two hand Single hand Single Hand

UI iPhone UI on OS-X Adobe Flash Lite UI Windows Mobile &HTC’s TouchFLO

Finger input only applications: DSC, Car navigation, PMP, MP3, information displayFor PDA, smart phone or GPS, UI can cover the need of pen writing using on-screen keypad.

• Capacitive Type Touch Panel• Proximity of object to sensor provide different capacitance value for sensors• Detection of sensor can be done with two types

• E-field Sensor• Detection of capacitance by change of electric field

• Capacitive Sensor• Detection of capacitance by measuring holding charge

• Other sensor types• Inductive Sensors

• Detection of the proximity of metal objects only (electro-magnetic)• Optical Sensors

Non-Contact Presence Sensors (Proximity)

• Sensor Design Consideration

Capacitive Touch Panel

TPII Proposal v1

Feature:

Easy Process- Not necessary to be traIt could be attached by 雙面膠 in module process.

Issue:

Thick module-An extra glass and AG film is necessary.

TFT

CF Glass

Glass (0.5mm)

LC

PFTouch Sensor Set

Color Resist

TFT

CF Glass

LC

PF

Color Resist

AG AG

TPII Proposal v2

Feature:

Thin module—No need extra glass.

Issue:

Process complexity– Due to CF maker could not pattern ITO, it is necessary to finish touch panel in Array Fab before CF process.

Color Resist

TFT

CF Glass

LC

PFTouch Sensor Set

TP side process

TP Sensor Process Flow

GlassGlass

ITOITO

MolyMoly

OC1OC1

Glass 入料Glass 入料 ITO SputterITO Sputter ITO EtchingITO Etching

Metal SputterMetal SputterMetal EtchingMetal Etching

OC1 depositOC1 deposit

APR PrintingAPR PrintingOC2 depositOC2 deposit

3F ITO line 2F TBM line 3F OC line

2F Cr line3F Metal etching line3F PI coater line3F PS line

On cell

TP2

TP side process

GlassITO Sputter

ITO Etching

OC1 ProcessMoly EtchingAPR Process

OC2 Process

ITO target

TP Sensor One Glass Process ( 5PEP )

Glass

BMTP sensor

Glass 入料Glass 入料 ITO SputterITO Sputter ITO EtchingITO Etching

Metal SputterMetal SputterMetal EtchingMetal Etching OC1 depositOC1 depositAPR PrintingAPR Printing

OC2 depositOC2 deposit

BM depositBM deposit

1. The original 6 peps design to a new 5 peps design.

2. The new 5 peps design has few advantages, as cost down, lead time reduced and etc.

`

ITO

OC1BM

Metal

OC2

OC0BM

ITOMetal

OC2

Compare 5 pep with 6 pep process

One glass _ Original design with OC0 process

Process sequence :

BM, black matrix

(black matrix frame) BM

OC0BM OC0BM

OC0BM

ITO

ITO,

(patterned sensor)

OC0, over coat layer0

(isolated BM and ITO)

One glass _ Original design with OC0 process

Process sequence :


(isolated ITO & metal)

Metal, metal bridge

(sensor connection)


(Protection coating) OC0BM

ITOMetal

OC2

OC0BM

ITOMetal

OC0BM

ITO

Process sequence :

BM, black matrix

(black matrix frame)

ITO,

(patterned sensor)


(isolated ITO & metal)

ITO

BM

BM

OC1BM

ITO

One glass _ New design remove OC0 process

`

OC1BM

Metal

ITO

`

OC1BM

Metal

ITO

Metal, metal bridge

(sensor connection)


(Protection coating)

OC2

One glass _ New design remove OC0 process

CF side process

CF Process Flow

Glass reserveGlass reserve BM FormationBM Formation R resistorcoating

R resistorcoating

OCOCITOITOPSPS

B resistorcoating

B resistorcoating

G resistorcoating

G resistorcoating

2F RED line 2F BLU line

2F GRN line2F Thermal OC line2F ITO line2F PS line

Cr BM Process

空白玻璃鍍第一層 Cr 膜上光阻 (coating)

對準 , 曝光 (stepping)

顯影液

顯影 (developing) 蝕刻 (etching)

強酸液

去光阻 (striping)

去光阻液光罩

RBM Process

空白玻璃塗佈 Resin film

顯影成膜及硬烤

顯影液對準 , 曝光 (exposing)

光罩

RGB Process _ part 1 (2F_RGB line)

光罩

R 光阻塗佈 => Spin

曝光BM 玻璃

R 顯影成膜及硬烤B 光阻塗佈=> Spin

Slit coater

曝光

光罩Slit coater

RGB Process _ part 2 (2F_RGB line)

B 顯影成膜及硬烤 G 光阻塗佈=> Spin

曝光

B 顯影成膜及硬烤三色成品檢驗

Slit coater

OC Process (2F_Thermal OC line)

烘烤OC layer 塗佈

Spinless

RGB 基板

ITO Process

RGB+OC 基板

鍍好 ITO 膜之基板

在基板上放遮罩

移去遮罩之成品

濺鍍

ITO 靶

MVA Process (4F_MVA line)

MVA 光阻塗佈及旋轉

顯影烘烤

MVA 光罩

曝光

UV 燈

PS Process (2F_PS line)

PS 光阻塗佈及旋轉

顯影烘烤

PS 光罩

曝光

UV 燈

TPII Mask Design1. TPII 5m X 5m design ( Cypress Design )

2. TPII 5m X 5m design ( for Yokohama )

TPII V1 : 根據 Cypress Design Guide line 設計

Sensor size = 4.9mm x 4.9mmSensor spacing = 0.3mm Sensor bridge width = 50umSpace = 0.3mm

V2

Sensor size = 4.9mm x 4.9mmSensor spacing = 0.3mmDummy width = 240umITO spacing = 30um

Sensor size = 4.9mm x 4.9mmSensor spacing = 0.3mmDummy width = 60umITO spacing = 30um

Sensor density = 14*8

TPII Type G v2 Design Capacitive Sense Touch panel (Sample output:8/E)

Glass

sensor dummydummy

dummy sensordummy

30um

Sensors in 2 plane Sensors in the same plane

A

ITO300A

SiNx1000A

ITO300A

PC4033um

ITO300A

PC4033.0um

ITO300A

PC4033um

ITO300A

PC4033.0um

ITO300A

PC4033um

Glass

sensor sensordummy

30um

Glass

sensor sensor

30um60um

ITO bridge

B

Cypress : 10k TPII v2 : 40~50k (14X), 105pF (14X)

Type 1st insulator

2nd insulator

T% ( x, y ) R 7.5X (1X)

B SiNx PC403 95.36% (0.315,0.322) 28.8K (4.6k)

B PC403 PC403 91.53% (0.316,0.323) 23.6K (3.1k)

A PC403 PC403 91.90% (0.321,0.329) 23.2K (3.1k)

LCDs with Integrated Touch Panel (Current status)AUO Samsung

iTSPSamsunghTSP

TMD Wintek Cypress CapSense

SynapticOnyx

Sensor Type

In-cell Capacitive / Switch Sensor

ExternalResistive Sensor

In-cell Capacitive Sensor

In-cell Photo Sensor

In-cell Capacitive Sensor

Capacitive(in-cell or integrated on-cell)

External Capacitive Sensor

Detection Pressure

<50g (touch mura)

Pressure required

Pressure required

0g 0g 0g 0g

LCM Thickness LCM only LCM + 1 film LCM only LCM only LCM only LCM only LCM only + external TP

Input Method Finger or stylus Finger or stylus Finger or stylus

Finger or light pen

Finger or metal stylus



Pen Writing YES YES YES YES YES YES YES

Multi-touch YES NO YES YES YES YES YES

Issues Touch Mura Dual side process for CF

Touch Mura

Touch Mura Lighting required for sensing

Patterned ITO process for CF

Patterned ITO process for CF

Vendor focuses on TP on protection screen

Demo 3.6” QVGA 4.8” WSVGA7.0” WVGA(SID 2007)

3.5” QVGA 2.8” WQVGA (SID 2007)

3.5” QVGA(SID 2007)

LG PRADA phone

Currently, there are only 4 companies with multi-touch technology and patent license:1. Synaptics, 2. Cypress, 3. ALPS, 4. EMC

Touch Panel Technology Comparison AUO (Current) Traditional

ResistiveTraditional Capacitive

Multi-touchResistive

Multi-touchCapacitive

Photo Cypress CapSense

Sensor Type

In-cell Cap. / Switch Sensor

Resistive Sensor Capacitive Sensor Res. Sensor Array

Cap. Sensor Array

Photo Sensor Array

Cap. Sensor

Sensing Pressure Pressure Proximity Pressure Proximity Shadow Proximity

Pressure <50g < 30g 0g < 30g 0g 0g 0g

LCM Thickness LCM only LCM + 1 glass / film

LCM only LCM + 1 glass / film

LCM only LCM only LCM only

ITO for TP 0 2 1 2 1 0 1

Transmittance 80% 80% 90% 80% 90% 80% 90%

Input Method Finger or stylus Finger or stylus Finger or metal stylus

Finger or stylus


Finger or light pen


Pen Writing YES YES YES ** YES YES ** YES *** YES **

Multi-touch YES NO NO YES YES YES YES

Single Hand YES * YES * YES YES * YES YES **** YES

Detection Simple / Complicated

Simple Complicated Simple Complicated Most Complicated

Complicated

Issues Touch Mura vs pressure

TP cavity, film process, patterned ITO on CF

patterned ITO on CF

TP cavity, film process, patterned ITO on CF

patterned ITO on CF

Lighting required, complex algorithm

Patterned ITO for CF

Application HTC TouchMid / Small size application

LG Prada

Large / Mid Size application

Apple iPhone TMD WinTek

* Single hand operation can be achieved if pressure is < 20g** Stylus with metallic tip required for pen writing** Light Pen required for pen writing*** Single hand operation depends on software capability

Source: 全球產研整理 2000/10 & 2001/11, 中華液晶資訊網 2002/05, 工研院 IEK-IT IS 計畫 2006/03, 時緯科技 2003/05, Hi touch2005/04, Microtouch, G touch

Touch Panel Technology ComparisonTech.

Item

Capacitive Acoustic Optical Resistive

電磁感應式DigitizerSurface

Projected(NFI)

SAW APR InfraredPhoto Sensor

4W 5W 6W 7W 8W

Detection CurrentElectric

fieldWave

absorptionWave

generationLight

interruptionPhoto

currentVoltage Magnetic field

Input medium

Finger, conductive

stylus

Finger, Gloves, or conductive

stylus

Finger, Gloves

Finger, Gloves, or Stylus (All)

ObstacleFinger, Gloves

Finger, Gloves, or Stylus (All) 專用電磁筆

特性( 差異點 )

反應速度快、防污、防靜電及灰塵,

但容易因靜電或溼度造成誤動作,

每次使用需作校正, 成本高較不適用於小尺寸面

板高精確度,

抗震,

可在戶外陽光下使用,

不怕雨、水、灰塵等

怕水、油污及灰塵,

易受雜質干擾(

水,

溼氣)

拖曳、耐久性、穩定性佳,

防水、防塵、防油, 只需出廠校正一次,

無飄移現象, P

alm

reje

ction,

價格便宜

可靠性高,

但防水及防污較差、容易誤動作、解析度較差(

精密度不高), LE

D

發光量會衰退

應用於小尺寸面板,

容易因環境光而誤動作

不耐刮、壽命短、便宜

改良四線式不耐刮之缺點,

表層破損時仍可使用

耐刮、防電磁波、防雜訊

耐刮、準確度較高

特性同四線式,

耐溼度及環境溫度變化,

適合工業用途

電磁筆不需接觸到面板,

也可感應到位置訊息

優 / 缺

優點 :1. 防刮 , 耐高溫2. 透光度高3. 手輕微碰觸即可動作缺點 :1.製程較複雜2.過去有專利問題 , 成本較高 (APR例外 )3. 易受周圍環境影響 (Surface, SAW, IR)

優點 :1. 可整合現行製程

2.Longer life time

缺點 :1. 環境光影響大

優點 :1. 成本低 , 較輕薄2. 干擾性小3. 可增加 palm rejection function缺點 :1. 透光率差2.怕火3.需施加壓力才能感應

優點 :1.壓力感應度高2. 手掌接觸到面板時不會誤動作

缺點 :1.需專用電磁筆2. 體積大 , 組裝不

易 , LCD 內需設置硬體線路

Resolution1024 X 10244096 X 4096

1024 X 1024

4096 X 4096

1024 X 1024

4096 X 4096

1024 X 1024

4096 X 4096

100 X 1001000 X 720

1024 X 1024

1024 X 10244096 X 4096

( 視 Driver, 應用電壓及面板大小決定 )

1024 X 10244096 X 4096

Response time

15 ~ 24ms3ms/3M

<20ms <10ms <10ms 50 ~ 300ms<16.6ms(60Hz)

<20ms <8ms

Cost (USD)4 ~ 10/inch

5 ~ 8/inch

3 ~ 7/inch

--2 ~ 5/inch

0.6 ~ 1.4

/inch

1 ~ 2/inch

7 ~ 10

/inch

Touch Panel Technology ApplicationTech.

Appl.

Capacitive Acoustic Optical Resistive

電磁感應式DigitizerSurface

Projected(NFI)

SAW APR InfraredPhoto Sensor

4W 5W 6W 7W 8W

GD* ○ ○ ○ ○ ○ ○ ○ ○ △ △ ○

AV ○ ○ ○ △ △ ○

NB** ○ ○ ○ △ △ ○ ○

DT ○ ○ ○ ○ ○ ○ ○ ○ △ △ ○ ○

TV ○ ○ ○ ○ ○ ○ ○ △ △ ○

ApplicationSize

7” ↑

42” --

10” ↑

42” --

7” ↑

42” --2” ↑ 42”

--19” ↑ 2” ↑

2” ↑

80” --

7” ↑

21” --

* ATM, POI, POS, 公共查詢機 (KIOSK), 工業用設備 , 自動售票機 , 醫療器材 , OA 事務機 , 特殊用途設備** TABLET-PC

Source: 全球產研整理 2000/10 & 2001/11, 中華液晶資訊網 2002/05, 工研院 IEK-IT IS 計畫 2006/03, 時緯科技 2003/05, Hi touch2005/04, Microtouch, G touch, KEYTEC

△: 較少使用

source ：全球產研整理， 2001/11

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