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  • 7/29/2019 2SK213

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    2SK213, 2SK214, 2SK215, 2SK216

    Silicon N-Channel MOS FET

    ADE-208-1241 (Z)1st. EditionMar. 2001

    Application

    High frequency and low frequency power amplifier, high speed switching.

    Complementary pair with 2SJ76, J77, J78, J79

    Features

    Suitable for direct mounting

    High forward transfer admittance

    Excellent frequency response

    Enhancement-mode

    Outline

    1 23

    TO-220AB

    1. Gate

    2. Source

    (Flange)

    3. Drain

    D

    G

    S

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    2SK213, 2SK214, 2SK215, 2SK216

    Absolute Maximum Ratings (Ta = 25C)

    Item Symbol Ratings Unit

    Drain to source voltage 2SK213 VDSX 140 V

    2SK214 160

    2SK215 180

    2SK216 200

    Gate to source voltage VGSS 15 V

    Drain current ID 500 mA

    Body to drain diode reverse drain current IDR 500 mA

    Channel dissipation Pch 1.75 W

    Pch*1 30 W

    Channel temperature Tch 150 C

    Storage temperature Tstg 45 to +150 C

    Note: 1. Value at TC = 25C

    Electrical Characteristics (Ta = 25C)

    Item Symbol Min Typ Max Unit Test conditions

    Drain to source 2SK213 V(BR)DSX 140 V ID = 1 mA, VGS = 2 V

    breakdown voltage 2SK214 160 V

    2SK215 180 V

    2SK216 200 V

    Gate to source breakdown

    voltag

    V(BR)GSS 15 V IG = 10 A, VDS = 0

    Gate to source voltage VGS(on) 0.2 1.5 V ID = 10 mA, VDS = 10 V *1

    Drain to source saturation

    voltage

    VDS(sat) 2.0 V ID = 10 mA, VGD = 0 *1

    Forward transfer admittance |yfs| 20 40 mS ID = 10 mA, VDS = 20 V *1

    Input capacitance Ciss 90 pF ID = 10 mA, VDS = 10 V,

    Reverse transfer capacitance Crss 2.2 pF f = 1 MHz

    Note: 1. Pulse test

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    2SK213, 2SK214, 2SK215, 2SK216

    50 1000

    Case Temperature TC (C)

    150

    20

    Channe

    lDiss

    ipa

    tion

    Pc

    h(W)

    Power vs. Temperature Derating

    40

    60

    100

    200

    300

    Typical Output Characteristics

    12

    400

    500

    Drain to Source Voltage VDS (V)

    TC = 25C

    3.0

    VGS = 0.5 V

    2.5

    2.0

    1.5

    1.0

    3.5

    Dra

    inCurrent

    ID(mA)

    16840 20

    Typical Output Characteristics

    0.8

    VGS = 0.1V

    TC = 25C

    10

    20

    30

    60

    40

    50

    Drain to Source Voltage VDS (V)

    Drain

    Curren

    tID(mA)

    8040200 100

    0.7

    0.6

    0.5

    0.4

    0.30.2

    TC

    =

    25C

    25

    75

    Typical Transfer Characteristics

    3

    Gate Source Voltage VGS (V)

    4210 5

    100

    200

    300

    400

    500

    Drain

    Curren

    tID(mA)

    0

    VDS = 20 V

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    2SK213, 2SK214, 2SK215, 2SK216

    T

    C

    =

    25C

    25

    75

    Typical Transfer Characteristics

    1.2

    Gate Source Voltage VGS (V)

    1.60.80.40 2.0

    20

    40

    60

    80

    100

    Dra

    inCurren

    tID(mA)

    0

    VDS = 20 V

    Forward Transfer Admittance

    vs. Drain Current

    TC = 25C

    VDS = 20 V

    50

    Drain Current ID (mA)

    1001052 200

    10

    20

    50

    100

    200

    Forward

    Trans

    fer

    Adm

    ittanc

    e

    yfs

    (mS)

    5

    20

    100

    10 k 100 k

    1.0

    10

    Forward

    Trans

    ferA

    dm

    ittance

    yfs

    (mS)

    Forward Transfer Admittance

    vs. Frequency

    1 M

    500

    50 M0.05

    5 k

    0.1

    Frequency f (HZ)

    10 M

    TC = 25CV

    DS= 20 V

    ID = 10 mA

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    2SK213, 2SK214, 2SK215, 2SK216

    Package Dimensions

    0.5 0.12.54 0.5

    0.76 0.114

    .0

    0.5

    15

    .0

    0.3

    2.7

    9

    0.2

    18

    .5

    0.5

    7

    .8

    0.5

    10.16 0.2

    2.54 0.5

    1.26 0.15

    4.44 0.2

    2.7 MAX

    1.5 MAX

    11.5 MAX

    9.5

    8.0

    1

    .27 6

    .4+

    0.2

    0

    .1

    3.6+0.1-0.08

    Hitachi CodeJEDECEIAJMass (reference value)

    TO-220ABConformsConforms1.8 g

    As of January, 2001Unit: mm

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    2SK213, 2SK214, 2SK215, 2SK216

    Cautions

    1. Hitachi neither warrants nor grants licenses of any rights of Hitachis or any third partys patent,

    copyright, trademark, or other intellectual property rights for information contained in this document.

    Hitachi bears no responsibility for problems that may arise with third partys rights, including

    intellectual property rights, in connection with use of the information contained in this document.

    2. Products and product specifications may be subject to change without notice. Confirm that you have

    received the latest product standards or specifications before final design, purchase or use.

    3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,

    contact Hitachis sales office before using the product in an application that demands especially high

    quality and reliability or where its failure or malfunction may directly threaten human life or cause risk

    of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,

    traffic, safety equipment or medical equipment for life support.

    4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly

    for maximum rating, operating supply voltage range, heat radiation characteristics, installationconditions and other characteristics. Hitachi bears no responsibility for failure or damage when used

    beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable

    failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-

    safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other

    consequential damage due to operation of the Hitachi product.

    5. This product is not designed to be radiation resistant.

    6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without

    written approval from Hitachi.

    7. Contact Hitachis sales office for any questions regarding this document or Hitachi semiconductorproducts.

    Hitachi, Ltd.Semiconductor & Integrated Circuits.Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, JapanTel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109

    Copyright Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.

    Hitachi Asia Ltd.Hitachi Tower16 Collyer Quay #20-00,Singapore 049318Tel : -538-6533/538-8577Fax : -538-6933/538-3877URL : http://www.hitachi.com.sg

    URL NorthAmerica : http://semiconductor.hitachi.com/Europe : http://www.hitachi-eu.com/hel/ecgAsia : http://sicapac.hitachi-asia.com

    Japan : http://www.hitachi.co.jp/Sicd/indx.htm

    Hitachi Asia Ltd.(Taipei Branch Office)4/F, No. 167, Tun Hwa North Road,Hung-Kuo Building,Taipei (105), TaiwanTel : -(2)-2718-3666Fax : -(2)-2718-8180

    Telex : 23222 HAS-TPURL : http://www.hitachi.com.tw

    Hitachi Asia (Hong Kong) Ltd.Group III (Electronic Components)7/F., North Tower,World Finance Centre,Harbour City, Canton RoadTsim Sha Tsui, Kowloon,Hong KongTel : -(2)-735-9218Fax : -(2)-730-0281URL : http://www.hitachi.com.hk

    Hitachi Europe Ltd.Electronic Components Group.Whitebrook ParkLower Cookham RoadMaidenheadBerkshire SL6 8YA, United KingdomTel: (1628) 585000

    Fax: (1628) 585160

    Hitachi Europe GmbHElectronic Components GroupDornacher Strae 3D-85622 Feldkirchen, MunichGermanyTel: (89) 9 9180-0Fax: (89) 9 29 30 00

    Hitachi Semiconductor(America) Inc.179 East Tasman Drive,San Jose,CA 95134Tel: (408) 433-1990Fax: (408) 433-0223

    For further information write to:

    Colophon 2 0

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    www.datasheetcatalog.com

    Datasheets for electronics components.

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