2sk213
TRANSCRIPT
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2SK213, 2SK214, 2SK215, 2SK216
Silicon N-Channel MOS FET
ADE-208-1241 (Z)1st. EditionMar. 2001
Application
High frequency and low frequency power amplifier, high speed switching.
Complementary pair with 2SJ76, J77, J78, J79
Features
Suitable for direct mounting
High forward transfer admittance
Excellent frequency response
Enhancement-mode
Outline
1 23
TO-220AB
1. Gate
2. Source
(Flange)
3. Drain
D
G
S
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2SK213, 2SK214, 2SK215, 2SK216
Absolute Maximum Ratings (Ta = 25C)
Item Symbol Ratings Unit
Drain to source voltage 2SK213 VDSX 140 V
2SK214 160
2SK215 180
2SK216 200
Gate to source voltage VGSS 15 V
Drain current ID 500 mA
Body to drain diode reverse drain current IDR 500 mA
Channel dissipation Pch 1.75 W
Pch*1 30 W
Channel temperature Tch 150 C
Storage temperature Tstg 45 to +150 C
Note: 1. Value at TC = 25C
Electrical Characteristics (Ta = 25C)
Item Symbol Min Typ Max Unit Test conditions
Drain to source 2SK213 V(BR)DSX 140 V ID = 1 mA, VGS = 2 V
breakdown voltage 2SK214 160 V
2SK215 180 V
2SK216 200 V
Gate to source breakdown
voltag
V(BR)GSS 15 V IG = 10 A, VDS = 0
Gate to source voltage VGS(on) 0.2 1.5 V ID = 10 mA, VDS = 10 V *1
Drain to source saturation
voltage
VDS(sat) 2.0 V ID = 10 mA, VGD = 0 *1
Forward transfer admittance |yfs| 20 40 mS ID = 10 mA, VDS = 20 V *1
Input capacitance Ciss 90 pF ID = 10 mA, VDS = 10 V,
Reverse transfer capacitance Crss 2.2 pF f = 1 MHz
Note: 1. Pulse test
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2SK213, 2SK214, 2SK215, 2SK216
50 1000
Case Temperature TC (C)
150
20
Channe
lDiss
ipa
tion
Pc
h(W)
Power vs. Temperature Derating
40
60
100
200
300
Typical Output Characteristics
12
400
500
Drain to Source Voltage VDS (V)
TC = 25C
3.0
VGS = 0.5 V
2.5
2.0
1.5
1.0
3.5
Dra
inCurrent
ID(mA)
16840 20
Typical Output Characteristics
0.8
VGS = 0.1V
TC = 25C
10
20
30
60
40
50
Drain to Source Voltage VDS (V)
Drain
Curren
tID(mA)
8040200 100
0.7
0.6
0.5
0.4
0.30.2
TC
=
25C
25
75
Typical Transfer Characteristics
3
Gate Source Voltage VGS (V)
4210 5
100
200
300
400
500
Drain
Curren
tID(mA)
0
VDS = 20 V
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2SK213, 2SK214, 2SK215, 2SK216
T
C
=
25C
25
75
Typical Transfer Characteristics
1.2
Gate Source Voltage VGS (V)
1.60.80.40 2.0
20
40
60
80
100
Dra
inCurren
tID(mA)
0
VDS = 20 V
Forward Transfer Admittance
vs. Drain Current
TC = 25C
VDS = 20 V
50
Drain Current ID (mA)
1001052 200
10
20
50
100
200
Forward
Trans
fer
Adm
ittanc
e
yfs
(mS)
5
20
100
10 k 100 k
1.0
10
Forward
Trans
ferA
dm
ittance
yfs
(mS)
Forward Transfer Admittance
vs. Frequency
1 M
500
50 M0.05
5 k
0.1
Frequency f (HZ)
10 M
TC = 25CV
DS= 20 V
ID = 10 mA
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2SK213, 2SK214, 2SK215, 2SK216
Package Dimensions
0.5 0.12.54 0.5
0.76 0.114
.0
0.5
15
.0
0.3
2.7
9
0.2
18
.5
0.5
7
.8
0.5
10.16 0.2
2.54 0.5
1.26 0.15
4.44 0.2
2.7 MAX
1.5 MAX
11.5 MAX
9.5
8.0
1
.27 6
.4+
0.2
0
.1
3.6+0.1-0.08
Hitachi CodeJEDECEIAJMass (reference value)
TO-220ABConformsConforms1.8 g
As of January, 2001Unit: mm
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2SK213, 2SK214, 2SK215, 2SK216
Cautions
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received the latest product standards or specifications before final design, purchase or use.
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contact Hitachis sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installationconditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachis sales office for any questions regarding this document or Hitachi semiconductorproducts.
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For further information write to:
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